LED Heat Dissipation Device with Extruded Substrate and Insert Ring
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Solution Overview
Problem
Existing LED illuminating devices face challenges with high manufacturing costs and weight due to heat dissipation methods like die casting and insert molding, which limit their application range and efficiency.
Innovation Solution
The use of a heat dissipation device with a substrate and insert ring formed through extrusion, allowing for efficient heat dissipation and a compact design, where the substrate and insert ring are made of metal, particularly aluminum, with a heat conducting layer and holder for secure assembly and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If die casting process is used to manufacture heat dissipation device, then heat dissipation performance is improved, but weight increases and manufacturing cost increases
Solution Approach 1:
The heat dissipation device is divided into two separate components: a substrate and an insert ring. The substrate provides the primary heat dissipation function while the insert ring enhances thermal conduction at critical interfaces. This segmentation allows each component to be optimized independently, reducing overall weight while maintaining heat dissipation performance.
Solution Approach 2:
The heat dissipation device combines different materials with complementary properties: the substrate uses a material optimized for bulk heat dissipation, while the insert ring uses a material with superior thermal conductivity for interface heat transfer. This composite approach achieves high heat dissipation performance without the weight penalty of a fully dense die-casted component.
2Temperature
If die casting process is used to manufacture heat dissipation device, then heat dissipation performance is improved, but manufacturing cost increases
Solution Approach 1:
By dividing the heat dissipation device into substrate and insert ring components, each can be manufactured using simpler, more cost-effective processes. The substrate can be produced via extrusion or casting, while the insert ring can be machined or formed separately, avoiding the need for complex die casting molds and reducing overall manufacturing cost.
Solution Approach 2:
The substrate and insert ring are combined through thermal conduction at their interface, creating an integrated heat dissipation system. This merging of components achieves the thermal performance of a monolithic die-casted part while using lower-cost manufacturing processes for each individual component.
3Temperature
If heat dissipation device is disposed outside housing, then heat dissipation capacity is improved, but device complexity increases
Solution Approach 1:
The heat dissipation device is nested within the housing structure, with the substrate and insert ring positioned inside the housing to utilize its thermal mass and surface area for heat dissipation. This nested arrangement provides effective heat dissipation capacity while maintaining a compact, simple overall device structure without requiring external heat dissipation components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a cost-effective, efficient heat dissipation system that reduces manufacturing costs, enhances thermal conductivity, and allows for a more compact and reliable illuminating device design by spatially separating heat sources and increasing heat dissipation areas.
Implementation Method 1
an insert ring in thermal-conductive contact with the substrate
Data Source
AI summary
Various embodiments may relate to an illuminating device including a light engine, a housing and a driver contained in the housing, wherein the illuminating device further includes a heat dissipation device disposed in the housing which includes a substrate for supporting the light engine and an insert ring in thermal-conductive contact with the substrate.