LED Heat Pipe Assembly with Distal Sink
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Solution Overview
Problem
Conventional LED heat dissipation assemblies require direct connection to a heat sink, which limits placement options and can lead to corrosion and inefficient heat dispersal due to exposure to the environment.
Innovation Solution
A heat dissipation structure comprising heat conduits or pipes coupled to a heat sink plate with grooves, allowing for efficient heat transfer from an LED device while enabling the heat sink to be placed distally, reducing the need for direct exposure and minimizing material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional heat sink is directly connected to the LED, then heat can be effectively conducted from the LED to the heat sink, but the heat sink must be exposed to the outside atmosphere which causes corrosion and leakage concerns
Solution Approach 1:
The heat dissipation system is divided into separate functional components: an LED assembly housed within a sealed housing, and a heat sink positioned externally. The housing acts as a barrier separating the LED from the external environment, eliminating corrosion and leakage concerns while maintaining effective heat transfer through the housing structure.
2Loss of energy
If the heat sink is directly connected to the LED, then heat transfer is efficient, but the spatial constraints limit the placement of other LED device components
Solution Approach 1:
The heat sink is repositioned from a direct attachment to the LED to an external position adjacent to the housing. This spatial reconfiguration allows heat to be conducted through the housing structure to the externally positioned heat sink, freeing up internal space for other components while maintaining effective heat dissipation.
3Loss of energy
If a conventional heat sink is used, then heat can be dissipated to the environment, but the necessary bulk of the heat sink increases the overall device size and weight
Solution Approach 1:
The housing structure is designed with localized thermal conduction properties, incorporating features that efficiently transfer heat from the LED to the externally positioned heat sink. This allows the heat sink to be smaller and lighter while maintaining effective heat dissipation, as the housing acts as an integrated heat transfer pathway.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat transfer efficiency, reduces the size and weight of the heat sink, and protects internal components by effectively dissipating heat away from the LED device without direct exposure to the environment, thereby improving light output and reducing material and weight.
Implementation Method 1
The heat conduits conduct heat from the lighting element across a heat sink
Implementation Method 2
which then emits the heat away from the lighting device, to protect the internal components of the lighting device
Data Source
AI summary
A lighting device that includes a heat sink coupled to a heat dissipation structure. The heat dissipation structure can include heat conduits operatively coupled to a light emitting device to receive and emit heat from the light emitting device. The heat conduits conduct heat from the light emitting device to the heat sink that is disposed above the light emitting device to protect the internal components of the lighting device.