Passive LED Lamp Heat Sink Structure for High-Power Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-power LED lamps face significant challenges with heat dissipation, leading to reduced lighting efficiency and shortened lifespan due to ineffective waste heat management.
Innovation Solution
The design incorporates a passive heat dissipating element with a heat sink featuring fins, a first and second heat dissipating channel, and a venting system that utilizes natural convection and radiation to efficiently transfer heat away from the LED chips, while maintaining a lightweight and compact structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a passive heat dissipating element with heat sink and fins is used, then heat dissipation efficiency is improved, but device weight increases
Solution Approach 1:
The heat dissipation system is segmented into multiple functional components: heat sink base, fins, heat dissipating channels, and venting system. This segmentation allows each component to be optimized independently for its specific function while maintaining overall lightweight design.
Solution Approach 2:
The patent transitions from traditional bulky heat sinks to a three-dimensional finned structure with multiple heat dissipating channels. This dimensional optimization increases heat dissipation surface area without proportionally increasing weight, achieving efficient heat transfer while maintaining lightweight construction.
2Temperature
If heat sink with fins and heat dissipating channels is added, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple heat dissipation mechanisms (conduction through heat sink base, convection through fins and channels, and radiation) into a single integrated passive heat dissipating element. This consolidation achieves efficient heat transfer while avoiding the complexity of multiple separate active cooling components.
Solution Approach 2:
The heat dissipating system operates passively without requiring external power or control systems. Natural convection currents drive heat transfer through the fins and channels, and the venting system automatically releases hot air, eliminating the need for fans or pumps and reducing overall device complexity.
3Reliability
If passive heat dissipating element is used instead of active cooling, then device reliability is improved, but heat dissipation capability may be insufficient for high-power LEDs
Solution Approach 1:
The patent optimizes key parameters of the passive heat dissipating element including fin geometry, channel dimensions, and venting configuration. By carefully adjusting these parameters, the system achieves sufficient heat dissipation capability for high-power LEDs while maintaining passive operation and high reliability.
Solution Approach 2:
The heat sink is constructed from materials with high thermal conductivity to maximize heat transfer efficiency. The combination of thermally conductive materials with the finned structure and channel design creates a composite heat dissipation system that achieves high power handling capability without active cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively enhances heat dissipation, maintaining high luminous flux and extending the lifespan of LED lamps by ensuring efficient heat transfer and distribution, even under weight and space constraints.
Implementation Method 1
a passive heat dissipating element having a heat sink connected to the lamp shell... utilizes natural convection and radiation to efficiently transfer heat away from the LED chips
Implementation Method 2
a passive heat dissipating element having a heat sink connected to the lamp shell... utilizes natural convection and radiation to efficiently transfer heat away from the LED chips
Implementation Method 3
a passive heat dissipating element having a heat sink connected to the lamp shell, wherein the heat sink comprises fins
Data Source
AI summary
An LED lamp includes: a lamp shell including a lamp head and a lamp neck, the lamp head connects to the lamp neck; a passive heat dissipating element having a heat sink connected to the lamp shell, wherein the heat sink comprises fins, a total height of the lamp neck and the lamp head is greater than a height of the heat sink; a power source disposed in the lamp shell; and a light emitting surface connected to the heat sink of the passive heat dissipating element and comprising LED chips electrically connected to the power source. The light emitting surface and the heat sink are connected to form a heat transferring path from the LED chips to the passive heat dissipating element; wherein a lateral outline of the LED lamp detours around an axis of the LED lamp 360 degrees turning around to form a contour of the LED lamp, the outline includes an outline of the lamp neck and an outline of the heat sink, the outline of the lamp neck has a slope A which is a constant, the outline of the heat sink has a slope B which is a constant, and an absolute value of the slope A is greater than that of the slope B.