Heat Sink With Expandable Circumference for LED Thermal Coupling
Solution Overview
Problem
Existing heat dissipation devices in lamps face inefficiencies due to surface roughness reducing the contact area between thermally conductive bodies, leading to impaired performance and shortened service life, and high production costs for high surface quality coupling surfaces.
Innovation Solution
A heat dissipation device with a heat transfer body having a changeable outer circumference and a force deflection mechanism, allowing for a pressurized coupling that compensates for surface inaccuracies, increasing the effective coupling area and heat dissipation capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the contact surface between thermally conductive bodies is increased to improve heat transfer, then heat dissipation capacity is improved, but surface roughness reduces the actual contact area and coupling efficiency
Solution Approach 1:
The heat transfer body is designed with a changeable outer circumference that can be enlarged to create pressurized coupling. This dynamic adjustment allows the system to transition from a static contact interface to a pressurized interface, compensating for surface roughness and increasing the effective contact area without requiring high manufacturing precision of the coupling surfaces
Solution Approach 2:
The invention changes the physical state of the coupling by applying pressure through enlargement of the outer circumference. This parameter change (from normal contact to pressurized contact) transforms the thermal coupling efficiency, allowing standard materials with typical surface roughness to achieve high heat dissipation capacity without requiring polished or precision-finished surfaces
2Loss of energy
If high surface quality is produced to compensate for surface roughness effects, then heat transfer efficiency is improved, but production costs increase
Solution Approach 1:
The system uses the inherent elasticity of the materials to automatically compensate for surface inaccuracies when pressurized coupling is established. The materials self-adjust to fill gaps and increase contact area under pressure, eliminating the need for expensive high-quality surface production while maintaining high heat transfer efficiency
Solution Approach 2:
By changing the coupling parameter from simple contact to pressurized contact through enlargement, the system achieves high heat transfer efficiency using standard production processes. The pressure parameter transformation allows conventional materials and surfaces to perform at high efficiency levels without requiring costly precision manufacturing
3Reliability
If the operating power of the heat source is lowered to prevent heat build-up, then thermal coupling stability is improved, but usability and performance are reduced
Solution Approach 1:
The dynamic enlargement capability allows the heat transfer body to adapt to different operating conditions. When high power operation is needed, the outer circumference can be enlarged to create pressurized coupling that prevents heat build-up, maintaining thermal coupling stability without limiting the heat source's power output or usability
4Loss of energy
If the heat dissipation capacity is improved by optimizing coupling surfaces, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
Instead of complex static optimizations of coupling surfaces, the invention employs a simple dynamic mechanism - enlargement of the outer circumference - to achieve pressurized coupling. This single degree of freedom provides a straightforward way to optimize heat dissipation efficiency without complicating the device structure or requiring multiple optimization parameters
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency with standard materials, reduces production costs, and expands the range of uses by creating a larger effective coupling area, minimizing heat loss and preventing unwanted heat feedback.
Implementation Method 1
thermally coupled directly and/or indirectly to a heat source... heat can transfer from one body to the next and is thus conducted away from the place of heat generation
Implementation Method 2
the exertion of pressure causes surface inaccuracies using the inherent elasticity of the materials from which the bodies are made can be at least partially compensated
Data Source
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AI summary
The device has a heat sink body formed as a hollow cylinder and including an area (8) that is limited by an interior extent surface (10). A heat transfer body is indirectly and/or directly thermally couplable to a heat source i.e. LED. The heat transfer body has an outer circumference surface. The heat transfer body is formed with a changeable outer circumference such that a pressurized coupling load of the extent surface is produced with the circumference surface by extension of the outer circumference. The heat transfer body has articulated connected ring elbow segments (6a, 6b).