Light Emitting Device Heat Sink With Segmented Connection Structures
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Solution Overview
Problem
Existing lighting devices face inefficiencies in heat dissipation, particularly when achieving higher light output from a constant form factor, as current heat sink solutions are not sufficient to manage the increased thermal challenge.
Innovation Solution
A light emitting device with a heat sink element comprising two interconnected parts with specific connection structures and a spring screw mechanism, enhancing heat transfer efficiency through increased surface contact area and adjustable geometry, utilizing materials like thermal paste or graphite for improved conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a compact heat sink surrounds the light source, then the device maintains a constant form factor, but heat dissipation efficiency is insufficient for higher light output
Solution Approach 1:
The heat sink element is divided into two separate parts that can be connected in different configurations. This segmentation allows the heat sink surface area to be increased without proportionally increasing the volume occupied, thereby improving heat dissipation efficiency while maintaining a compact form factor suitable for higher light output applications
Solution Approach 2:
The patent transitions from a conventional single-part heat sink to a two-part configuration that可以利用 three-dimensional space more effectively. By arranging heat sink surfaces in multiple dimensions and orientations, the total heat dissipation area is increased without significantly increasing the overall device volume, resolving the contradiction between compact form factor and heat dissipation efficiency
2Loss of energy
If the heat sink surface area is increased to improve heat transfer, then heat dissipation efficiency improves, but the device volume increases
Solution Approach 1:
The two-part heat sink structure is designed to nest or interlock with each other, allowing one part to be positioned within or alongside the other. This nesting arrangement maximizes the heat sink surface area while minimizing the overall volume occupied, as the parts utilize the same spatial envelope rather than requiring separate volumes
Solution Approach 2:
The patent employs vertical stacking and multi-level arrangement of heat sink surfaces, transitioning from a two-dimensional footprint to a three-dimensional structure. This allows the heat sink area to be increased by utilizing the vertical dimension, thereby improving heat transfer efficiency without proportionally increasing the device's horizontal footprint or overall volume
3Loss of energy
If protruding and recessed elements are added to increase contact area, then heat transfer efficiency increases, but manufacturing complexity increases
Solution Approach 1:
The heat sink is segmented into two parts with complementary protruding and recessed elements. These features are designed as simple geometric shapes that can be easily manufactured using conventional processes such as injection molding or CNC machining. The segmentation allows each part to be manufactured separately with standard tools, avoiding the need for complex multi-step manufacturing processes while still achieving increased contact area and improved heat transfer efficiency
Solution Approach 2:
Instead of making the entire heat sink structure complex, the patent applies protruding and recessed elements only at specific localized areas where heat transfer is most critical. This local quality approach increases contact area and heat transfer efficiency at key interfaces without requiring complex features throughout the entire structure, thereby maintaining ease of manufacture for the overall component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves heat dissipation by increasing the heat transfer surface area and allowing for adjustable geometry, effectively managing thermal challenges and maintaining reliable contact despite variations in temperature and expansion.
Implementation Method 1
the first connection structure and the second connection structure are configured to, in a mounted condition, be in mutual contact with one another for transferring heat from the first part to the second part
Implementation Method 2
the first part and the second part are mutually connected and fastened through a spring screw mechanism having a spring screw extending in a fixed orientation parallel to the first and second outer surface
Data Source
AI summary
A light emitting device comprising a light source, a housing, a casing and a heat sink element, the casing comprising a connection surface, the heat sink element comprising a first part configured to be connected to the light source, and a second part configured to be connected to the first part, wherein the first part comprises a first connection structure and the second part comprises a second connection structure, and wherein the first connection structure and the second connection structure are configured to, in a mounted condition, be in mutual contact with one another for transferring heat from the first part to the second part.