LED Heat Transfer Device Bridging Attic and Room
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED lamps face inefficiencies in thermal management, leading to higher temperatures and increased costs due to the reliance on attic heat dissipation, which limits luminous efficiency and requires more LEDs to achieve desired luminous power outputs.
Innovation Solution
A heat transfer system that utilizes a thermal dissipator positioned within a cooler area, such as a room, to efficiently transfer and dissipate heat from LED lamp components, reducing the number of LEDs needed by enhancing thermal management efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation relies on attic area, then LED lamp can be mounted in recessed housing, but surface temperature of LED components exceeds temperature threshold
Solution Approach 1:
A thermal dissipator is introduced as an intermediary component between the LED components and the surrounding environment. The thermal dissipator includes a first portion in thermal communication with the LED components and a second portion extending into the room area, facilitating heat transfer from the high-temperature attic area to the lower-temperature room area through conduction and convection.
Solution Approach 2:
The invention extends the heat dissipation path from the traditional two-dimensional surface area of LED components into the third dimension by positioning the thermal dissipator's second portion in the room area below the ceiling. This creates a vertical heat transfer pathway that utilizes the temperature differential between attic and room spaces.
2Illumination intensity
If more LEDs are used to achieve desired luminous power output, then luminous output requirement is met, but cost of LED lamp increases
Solution Approach 1:
The invention changes the thermal management parameters by utilizing the temperature differential between attic and room areas. By improving the heat dissipation efficiency through the thermal dissipator, the LED components can operate at lower temperatures, increasing their luminous efficiency and allowing fewer LEDs to achieve the desired luminous power output.
3Temperature
If thermal management efficiency is improved, then surface temperature of LED components is reduced, but device complexity increases
Solution Approach 1:
The thermal dissipator serves multiple functions: it acts as a heat conduction path from LED components, provides convection surface area for heat dissipation into the room, and structurally integrates with the recessed housing assembly. This multi-functionality reduces the need for separate cooling components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the surface temperature of LED components, increases luminous efficiency, and decreases the number of LEDs required, thereby lowering the cost of LED lamps while maintaining or exceeding desired luminous outputs.
Implementation Method 1
a heat transfer device with a first end mounted to the board surface, and a second end mounted to the thermal dissipator, to transfer the heat energy from the board surface in the first area to the thermal dissipator in the second area
Implementation Method 2
dissipate the heat energy from the thermal dissipator within the second area
Implementation Method 3
The side wall has a first end thermally coupled to the board surface and a second end thermally coupled to the thermal dissipator. The side wall transfers the heat energy from the board surface in the first area to the thermal dissipator in the second area
Implementation Method 4
an air flow device to generate a flow of air along the trim. The trim directs the generated flow of air in an outward radial direction over the trim, to enhance the dissipation of the heat energy from the trim within the room
Data Source
AI summary
A heat transfer system is provided for a LED lamp. The LED lamp includes a board surface to supply heat energy during an operation of the LED lamp. The LED lamp is mounted within a recessed housing that separates a first area having a first temperature from a second area having a second temperature, where the second temperature is lower than the first temperature. The system includes a thermal dissipator positioned within the second area. The system further includes a heat transfer device with a first end mounted to the board surface, and a second end mounted to the thermal dissipator, to transfer the heat energy from the board surface in the first area to the thermal dissipator in the second area, and dissipate the heat energy within the second area.