LED Heat Transfer Members for Phosphor Thermal Dissipation

The patent introduces heat transfer members as intermediary elements between the phosphor-containing sealing resin and the metal mounting substrate. These members (such as heat transfer paste, heat transfer sheets, or heat transfer pins) act as mediators to bridge the thermal gap, enabling efficient heat transfer from the phosphor particles to the substrate without requiring direct contact between phosphor and substrate.

The patent transitions from a single-plane heat transfer approach to a multi-dimensional heat dissipation structure. By adding heat transfer members that extend vertically from the substrate surface into the sealing resin, the heat transfer path is extended into the third dimension, increasing the heat transfer area and efficiency without expanding the horizontal footprint.

The heat transfer members are designed to perform multiple functions simultaneously: they serve as heat transfer pathways, structural support elements, and sometimes even as part of the electrical connection system. This multi-functionality reduces the need for separate dedicated components, thereby limiting the increase in device complexity.

The patent combines the heat transfer function with existing structural elements of the LED package. For example, the heat transfer members are integrated with the mounting substrate and sealing resin structure, rather than being added as completely separate components. This merging approach minimizes the increase in overall device complexity.