Light Emitting Device Package Heatsink Thermal Bridge
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Solution Overview
Problem
Light emitting device packages using silicon substrates suffer from inferior thermal emission characteristics, leading to degraded light emission performance due to high thermal resistance.
Innovation Solution
Incorporating a novel structure with first and second heatsinks, disposed within and below the substrate respectively, to effectively transfer and emit heat generated by the light emitting device, along with electrically separated electrodes for efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a silicon substrate is used to support the light emitting device, then the device structure is simple and easy to manufacture, but the thermal resistance is high causing inferior thermal emission characteristics
Solution Approach 1:
A heatsink structure is introduced as an intermediary component between the light emitting device and the silicon substrate. The heatsink includes a heat dissipation portion extending into the substrate and a heat emission portion exposed on the substrate surface, creating a thermal bridge that improves heat transfer while maintaining the simplicity of using a silicon substrate.
Solution Approach 2:
The heatsink structure extends in the vertical dimension into the substrate (first direction) and also provides surface area on the substrate top surface (second direction). This multi-dimensional approach allows heat to be conducted downward into the substrate while also being emitted laterally from the surface, effectively addressing thermal management without complicating the manufacturing process.
2Device complexity
If the light emitting device is directly mounted on the substrate, then the device structure is simple, but heat accumulation occurs degrading light emission performance
Solution Approach 1:
The heatsink acts as a thermal intermediary between the light emitting device and the substrate, providing dedicated heat conduction pathways through its heat dissipation portion while its heat emission portion provides additional thermal management capability on the surface, thereby preventing heat accumulation without significantly increasing device complexity.
Solution Approach 2:
The heatsink structure serves multiple functions simultaneously: it provides mechanical support for the light emitting device, conducts heat away from the device through its dissipation portion, and emits heat from the substrate surface through its emission portion. This multi-functionality improves reliability without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances thermal emission characteristics, improving the light emitting device package's performance by efficiently managing heat, thereby maintaining and enhancing light emission quality.
Implementation Method 1
a first heatsink between the substrate and the light emitting device, the first heatsink being at least partially disposed within the substrate to transfer heat generated from the light emitting device
Data Source
AI summary
A light emitting device package including a substrate; a light emitting device on the substrate; a first heatsink between the substrate and the light emitting device to transfer heat generated from the light emitting device; a second heatsink disposed below the first heatsink; and an electrode between the first heat sink and the light emitting device. Further, the substrate is disposed between the first and second heatsinks and is narrower at a position between the first and second heatsinks than at a position not between the first and second heatsinks, a material of the substrate is the same at the position between the first and second heatsinks as not between the first and second heatsinks, and the substrate at the position not between the first and second heatsinks surrounds the first and second heat sinks.