Light Emitting Device Manufacturing via Hole-Formed Reflective Member
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Solution Overview
Problem
Existing light emitting devices have a large thickness between the light-emitting surface and the back surface due to the inclusion of a wiring board, which can limit their compactness and efficiency.
Innovation Solution
A method for manufacturing a light emitting device involves creating an intermediate structure with layered structures, including a light reflecting member, semiconductor layers, and a light transmissive member, where conductive films are formed on exposed electrodes and holes are created to reduce thickness and enhance light extraction, allowing for the production of smaller, more efficient devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a wiring board is included in the light emitting device structure, then electrical connection and support are provided, but the thickness between the light-emitting surface and the back surface becomes large
Solution Approach 1:
The patent removes the wiring board from the light emitting device structure entirely. The electrodes are directly formed on the semiconductor layered structure, and the light reflecting member serves as the structural support, eliminating the need for a separate wiring board and thereby reducing device thickness.
Solution Approach 2:
The light reflecting member is designed to serve multiple functions: it provides structural support, acts as an electrical connection path, and performs light reflection. This multi-functionality replaces the need for a separate wiring board, reducing overall device thickness while maintaining all necessary functions.
2Length of stationary object
If the device thickness is reduced by removing the wiring board, then compactness is improved, but electrical connection and structural support become more difficult to implement
Solution Approach 1:
The patent merges the functions of the wiring board, electrodes, and light reflecting member into a single integrated structure. The electrodes are directly formed on the semiconductor layered structure, and the light reflecting member provides both structural support and electrical connection, simplifying the overall device structure while reducing thickness.
3Illumination intensity
If holes are formed in the light reflecting member, then light extraction efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The light reflecting member is segmented by forming holes at specific positions, creating a patterned structure that improves light extraction. The holes are formed in a regular pattern between adjacent layered structures, allowing systematic manufacturing while enhancing optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of smaller light emitting devices with improved light extraction efficiency by reducing the thickness between the light-emitting surface and the back surface, enhancing their compactness and performance.
Implementation Method 1
a light reflecting member 21 covering side surfaces of the light emitting element 10 and the light transmissive member 16
Data Source
AI summary
A method for manufacturing a light emitting device includes: providing an intermediate structure including first and second layered structures arranged in a first direction in a light reflecting member, wherein each of the layered structures includes a first and second electrodes arranged in a second direction, and wherein the intermediate structure has a first surface at which the first and second electrodes are exposed; on the first surface, forming a first hole in the light reflecting member between the first electrodes as viewed in the second direction; on the first surface, forming a second hole in the light reflecting member between the second electrodes as viewed in the second direction; forming a conductive film on exposed surfaces of the first and second electrodes, and in the first and second holes; and severing the light reflecting member and the conductive film at positions that pass through the first and second holes.