LED Illumination Device Thermal Management via Integrated Housing
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Solution Overview
Problem
Conventional LED illumination devices face challenges in downsizing, leading to variations in optical characteristics such as lighting intensity and light-distribution due to dimensional variations and heat transfer issues, which affect the positional accuracy and efficiency of the components.
Innovation Solution
The design includes a point light source on a base substrate sealed with a wavelength converter, an optical member, and a housing with a bonding part that directly attaches to the package, providing a space for heat release and reducing heat transfer to the lens, thereby maintaining optical characteristics and improving lighting intensity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LED packages and lens are attached via housing, then assembly is simplified, but positional accuracy deteriorates due to dimensional variations
Solution Approach 1:
The patent merges the housing and circuit board into a single integrated structure. The housing directly serves as the mounting substrate for LED packages, eliminating the need for separate attachment via housing. This integration ensures that the lens positioning reference face and LED package mounting face are on the same structural element, thereby maintaining positional accuracy while simplifying assembly steps.
2Illumination intensity
If lighting current is increased to increase lighting intensity, then illumination brightness improves, but heat generation increases causing temperature rise
Solution Approach 1:
The patent introduces a heat dissipation structure as an intermediary between the LED packages and the lens. This structure includes a heat dissipation protrusion that extends from the circuit board toward the lens, creating a thermal barrier that intercepts heat before it reaches the lens. This allows higher lighting current to be applied for increased brightness while preventing excessive heat transfer to the lens.
3Volume of moving object
If lens is directly attached to base substrate, then structural compactness improves, but heat transfer to lens increases causing optical characteristic variations
Solution Approach 1:
The patent positions the heat dissipation protrusion as an intermediary element between the LED packages and the lens. This protrusion creates a thermal barrier that prevents direct heat transfer to the lens while maintaining the compact overall structure. The lens remains closely positioned to the base substrate for compactness, but the heat dissipation structure intercepts thermal energy before it reaches the lens, preserving optical characteristic stability.
4Adaptability or versatility
If housing and circuit board are separate components, then manufacturing flexibility improves, but device size increases
Solution Approach 1:
The patent merges the housing and circuit board into a single integrated component. The housing structure directly incorporates the circuit board mounting functions, eliminating the need for separate housing and circuit board components. This integration reduces the overall device volume while maintaining manufacturing flexibility through modular LED package and lens assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces heat impact on optical characteristics, stabilizes lighting intensity, and enhances light-distribution control, while also improving the heat-release performance and extending the operational life of the LED illumination device.
Implementation Method 1
a package in which the point light source is sealed with a wavelength converter for converting a wavelength of light from the point light source
Implementation Method 2
The bonding part of the housing is directly positioned and fixed to a reference face of the package... effectively reduces heat impact on optical characteristics
Data Source
AI summary
An illumination device includes a point light source disposed on a base substrate, a package in which the point light source is sealed with a wavelength converter for converting a wavelength of light from the point light source, an optical member for controlling light from the package, a housing with an attachment face for holding the optical member and a bonding part for holding the package, and a circuit board on which the package is mounted. A space is provided between the wavelength converter and the optical member. The bonding part of the housing is directly positioned and fixed to a reference face of the package. This makes the heat generated from the LED chip released via the housing. Accordingly, a heat quantity transferred to the lens can be reduced.