Light Emitting Element Housing Package with Localized Surface Roughness for Thermal Management
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Solution Overview
Problem
Existing light emitting modules face challenges in integration and heat radiation due to the dimensions and heat conductivity of element housing packages, limiting the compactness and efficiency of light emitting devices.
Innovation Solution
A light emitting element housing package with a base part featuring a first recessed area for mounting light emitting elements, where the surface roughness of the bottom surface is less than the surrounding area, enhancing heat conductivity and positioning accuracy, and a frame part for improved heat dissipation and sealing, using materials like tungsten, molybdenum, and gold for conductor layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional element housing package is used, then the structure is simple and easy to manufacture, but the heat radiation performance is insufficient and integration is limited
Solution Approach 1:
The patent applies local quality by creating a recessed part with a specific surface roughness (Sa ≤ 0.8 μm) in a localized region of the base part, while other regions maintain different properties. This localized modification improves heat radiation from the light emitting element without requiring the entire package structure to be redesigned, thus enhancing thermal performance while limiting overall complexity increase.
Solution Approach 2:
The patent employs composite materials by combining the base part (made of heat-radiating material) with a light emitting element and sealing members. The base part itself may incorporate materials with specific thermal conductivity properties, creating a composite structure that optimizes both heat radiation and structural integrity, resolving the contradiction between simple structure and thermal performance.
2Illumination intensity
If the surface roughness of the mounting region is increased to improve light extraction, then light emission efficiency improves, but heat conductivity deteriorates
Solution Approach 1:
The patent resolves this contradiction by applying different surface roughness values to different regions: the light extraction region has higher roughness (Sa > 0.8 μm) to enhance light emission, while the heat conduction region (bottom surface of recessed part) has lower roughness (Sa ≤ 0.8 μm) to maintain thermal contact. This spatial differentiation of surface properties allows simultaneous optimization of both light extraction and heat conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables stable mounting of high heat-generation light emitting elements, improving heat radiation and extending the lifespan of light emitting devices and modules by efficiently dissipating heat through the substrate and sealing members.
Implementation Method 1
improving heat radiation and extending the lifespan of light emitting devices and modules by efficiently dissipating heat through the substrate
Data Source
AI summary
A light emitting element housing package of the present disclosure includes a base part including a first surface including a first recessed part for mounting a light emitting element. Surface roughness Sa of at least such a region of a bottom surface of the first recessed part that is opposite to a light emitting element mounted on the first recessed part is smaller than surface roughness Sa of a region other than the first recessed part of the first surface. Further, a light emitting device of the present disclosure includes the light emitting element housing package and a light emitting element housed in the light emitting element housing package. Further, a light emitting module of the present disclosure includes the light emitting device and a module substrate on which the light emitting device is mounted.