LED Illumination Device Thermal Dissipation via Ceramic Insulator
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Solution Overview
Problem
Conventional LED bulbs require soldering steps during manufacturing, leading to increased costs and inefficiencies, and have limited thermal dissipation capabilities due to a plastic component that restricts heat transfer from the LED module to the lamp base, resulting in frequent overheating.
Innovation Solution
The LED bulb features a driver circuit board that is mechanically plugged into the lamp base without soldering, and an insulating unit with a sleeve member and shield member made of thermal-conductive materials to extend the heat-dissipation path from the heat sink to the lamp base, allowing for effective heat transfer through the bulb socket.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering steps are used to connect the driver circuit board to the lamp base, then electrical connection reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces the traditional soldering process with a mechanical plug-in connection system. The driver circuit board is equipped with a plug that directly inserts into a socket on the lamp base, eliminating the need for soldering while maintaining reliable electrical connection. This mechanical connection approach simplifies manufacturing processes and reduces production costs while ensuring stable electrical connectivity between components.
Solution Approach 2:
The patent divides the lamp assembly into separable modules: the driver circuit board as one module and the lamp base as another module. Each module has independent connection interfaces (plug and socket) that enable easy assembly and disassembly without requiring complex soldering operations. This modular segmentation improves both manufacturing efficiency and product reliability.
2Reliability
If a plastic component is disposed between the heat sink and lamp base to prevent shorting, then electrical insulation is improved, but thermal dissipation capability deteriorates
Solution Approach 1:
The patent introduces a ceramic insulating piece as an intermediary component between the heat sink and lamp base. This ceramic component provides both electrical insulation to prevent shorting and thermal conduction to dissipate heat effectively. The ceramic material serves as a mediator that simultaneously satisfies both electrical and thermal requirements, overcoming the limitations of plastic materials that only provide insulation but block heat transfer.
Solution Approach 2:
The patent employs ceramic material that combines properties of both electrical insulator and thermal conductor. This composite material approach allows the insulating piece to perform dual functions: maintaining electrical isolation between components while enabling efficient heat dissipation from the LED module through the heat sink to the lamp base.
3Device complexity
If only a single heat-dissipation path from LED module to heat sink is used, then device structure is simplified, but thermal dissipation efficiency is insufficient
Solution Approach 1:
The patent extends the heat dissipation path from a single-dimensional path (LED module to heat sink) to a multi-dimensional path by utilizing the lamp base as an additional heat dissipation route. The heat can now flow from the LED module through the heat sink to the lamp base, and also through the bulb socket to the external environment. This dimensional extension of the heat dissipation pathway significantly improves thermal management without substantially increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the assembly process, eliminates the need for soldering, enhances thermal dissipation by creating additional heat paths, and reduces the risk of overheating by efficiently transferring waste heat from the LED module to the ambient environment.
Implementation Method 1
an insulating unit with the sleeve member inside the lamp base for the purpose of extending the heat-dissipation path from the heat sink to the lamp base
Implementation Method 2
a shield member of the insulting unit made of high thermal conductivity materials (such as ceramic) may be applied between the first electrode and the lamp base to create another heat dissipation path from the first electrode to the lamp base by convection dissipation
Implementation Method 3
create another heat dissipation path from the first electrode to the lamp base by convection dissipation
Implementation Method 4
the waste heat generated by the light module can be dissipated not only by the built-in heat sink but also by the bulb socket... The secondary heat-dissipation path, which thermal conductively connects the heat sink to the lamp base (further connects the lamp base to the bulb socket), greatly extends the heat dissipation path
Data Source
AI summary
An illumination device having enhanced thermal dissipating capacity is provided. The illumination device includes a heat sink, an LED module, a cover, an LED driver, and a lamp base. The LED module is disposed at one end of the heat sink. The cover covers the LED module. The LED driver is in connection with the LED module, and includes a circuit board and at least one electrical contact member disposed on the circuit board. The lamp base is connected to the other end of the heat sink, and comprises an insulating unit, a first electrode, a second electrode and at least one contact port. The contact port is arranged on the lateral interior of the insulating unit, so that the electrical contact member of the LED driver may establish electrical connection with the lamp base.