Light Emitting Device Inner Conductive Members
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Solution Overview
Problem
Light emitting devices with semiconductor elements face challenges in achieving a balance between productivity and heat dissipation performance due to the use of thick resin layers and metal pillars, which lead to increased thermal resistance and manufacturing inefficiencies.
Innovation Solution
A light emitting device design incorporating a semiconductor light emitting element with a resin layer and inner conductive members that combine metal plating layers and metal wires to connect electrodes, reducing thermal resistance and manufacturing time while maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thick resin layer and metal pillars are used to support the light emitting element and ensure structural integrity, then the mechanical strength is improved, but the thermal resistance increases and heat dissipation performance deteriorates
Solution Approach 1:
The support structure is segmented into multiple functional layers: a resin layer for mechanical support, a reflective layer for light extraction enhancement, and a conductive layer for heat dissipation. This segmentation allows each layer to optimize its specific function without compromising overall performance.
Solution Approach 2:
The patent employs composite material structures combining resin, metal reflective layers, and conductive materials. This composite approach enables simultaneous achievement of mechanical strength, optical performance, and thermal management in a single integrated structure.
2Strength
If metal pillars with sufficient thickness are formed to ensure structural strength, then the mechanical support is improved, but the manufacturing time increases due to long plating periods
Solution Approach 1:
The conductive path is segmented into multiple thinner layers rather than forming one thick metal pillar. This allows each layer to be plated quickly while achieving sufficient overall conductivity and structural support through the stacked configuration.
Solution Approach 2:
The conductive layers serve multiple functions: electrical connection, heat dissipation, and partial mechanical support. This multi-functionality reduces the need for excessively thick single-purpose metal pillars, thereby shortening plating time while maintaining productivity.
3Strength
If the thickness of the resin layer is increased to provide sufficient support, then the mechanical strength is improved, but the thermal resistance increases and manufacturing efficiency decreases
Solution Approach 1:
The patent creates a composite structure where the resin layer is combined with metal reflective and conductive layers. This composite design allows the resin layer to be thinner since the metal layers provide additional structural support and heat dissipation pathways, thereby improving both mechanical strength and thermal performance while reducing overall thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combination of metal plating layers and metal wires in the inner conductive members enhances heat dissipation and manufacturing efficiency, improving the balance between productivity and thermal performance.
Implementation Method 1
The combination of metal plating layers and metal wires in the inner conductive members enhances heat dissipation
Data Source
AI summary
A method of manufacturing one or more light emitting devices includes: forming one or more emitting elements, each including a first conductive type semiconductor layer, a second conductive type semiconductor layer, a first electrode, and a second electrode, on a growth substrate; forming a first metal layer electrically connected to each first electrode, and a second metal layer electrically connected to each second electrode; forming a first resin layer covering the one or more light emitting elements so as to expose an upper surface of each first metal layer and an upper surface of each second metal layer; connecting a first wire to the upper surface of each first metal layer, and connecting a second wire to the upper surface of each second metal layer; and forming a second resin layer on the first resin layer so as to expose an end portion of each first wire and second wire.