LED Heat-Conducting Insulating Layer for Thermal Management
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Solution Overview
Problem
Conventional LED devices have inefficient heat-dissipating efficiency, particularly those with combined heat and electric power conduction paths, which limits their performance.
Innovation Solution
Designing a light-emitting device with a heat-conducting and electrically-insulating layer on the heat-dissipating portion to create a shortest heat-conduction path and separate electric-conduction path, utilizing penetrating heat-conducting structures in the substrate unit to enhance heat dissipation, regardless of the LED chip type (vertical or horizontal).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the LED device uses a combined path for conducting heat and electric power, then the device structure is simplified, but the heat-dissipating efficiency cannot be increased efficiently
Solution Approach 1:
The patent divides the conduction path into separate heat-conduction path and electric-conduction path. The heat-conduction path includes the heat-conducting and electrically-insulating layer and penetrating heat-conducting structures, while the electric-conduction path uses separate electrically-conducting portions. This segmentation allows independent optimization of heat dissipation without compromising electrical connectivity.
Solution Approach 2:
The heat-conducting and electrically-insulating layer acts as an intermediary that conducts heat from the light-emitting chip while electrically insulating the electrically-conducting portions from direct contact with the substrate. This intermediary enables thermal transfer while preventing electrical interference, resolving the contradiction between structural simplicity and heat-dissipating efficiency.
2Loss of energy
If the heat-conducting and electrically-insulating layer is placed on the heat-dissipating portion, then the heat-dissipating efficiency is increased, but the electric-conduction path requires separate planning
Solution Approach 1:
The patent segments the functional layers into distinct heat-conduction components and electric-conduction components. The heat-conducting and electrically-insulating layer is placed on the heat-dissipating portion to optimize thermal transfer, while the electrically-conducting portions are arranged separately to provide independent electrical pathways. This segmentation reduces the complexity of coordinating both conduction paths simultaneously.
Solution Approach 2:
Different regions of the device are assigned different functional qualities: the heat-dissipating portion receives the heat-conducting and electrically-insulating layer for optimized thermal management, while other regions are designed for electrical conduction. This local differentiation allows each region to be optimized for its specific function without compromising the other.
3Device complexity
If conventional LED devices are used, then the device structure is simple, but the light-emitting efficiency is limited due to poor heat dissipation
Solution Approach 1:
The patent introduces penetrating heat-conducting structures that extend vertically through the substrate, creating a three-dimensional heat-dissipation architecture. This vertical dimension complements the horizontal heat-conduction layer, providing multi-directional heat removal pathways that significantly enhance light-emitting efficiency without substantially increasing overall device complexity.
Solution Approach 2:
The patent employs composite material structures including the heat-conducting and electrically-insulating layer combined with penetrating heat-conducting structures made of thermally-conductive materials. This composite approach integrates multiple material properties (thermal conductivity, electrical insulation) into a unified structure that simultaneously addresses heat dissipation and maintains electrical functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly increases heat-dissipating efficiency and light-emitting efficiency by optimizing the heat-conduction and electric-conduction paths, ensuring effective heat dissipation for both vertical and horizontal type LED chips.
Implementation Method 1
a heat-conducting and electrically-insulating layer (20) disposed on the heat-dissipating portion (111)
Implementation Method 2
heat-conducting and electrically-insulating layer (20)
Implementation Method 3
a plurality of penetrating heat-conducting structures (35) penetrating through the substrate body (30)
Data Source
AI summary
A light-emitting device includes a light-emitting element and a heat-conducting and electrically-insulating element. The light-emitting element includes at least one first conductive frame having at least one first electrically-conducting portion and at least one heat-dissipating portion, at least one second conductive frame adjacent to the first conductive frame and having at least one second electrically-conducting portion, a casing enclosing the first conductive frame and the second conductive frame, and at least one light-emitting chip disposed on the first conductive frame. The heat-conducting and electrically-insulating element includes a heat-conducting and electrically-insulating layer disposed on the heat-dissipating portion for insulating an electrical current from the heat-dissipating portion. Hence, the instant disclosure can plan a heat-conduction path and an electric-conduction path for the light-emitting chip to effectively increase the heat-dissipating efficiency of the light-emitting element due to the design of placing the heat-conducting and electrically-insulating layer on the heat-dissipating portion.