Light Emitting Device Insulating Support Member Burr Prevention
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Solution Overview
Problem
Current light emitting devices face challenges in reliability and efficiency due to issues with substrate separation and burr formation during chip separation, which affects the alignment and performance of light emitting diodes.
Innovation Solution
The proposed solution involves a light emitting device structure with a support member made of insulating material under the light emitting structure layer, featuring conductive layers with wider widths and contact parts to improve adhesion and prevent burr formation, along with a method for fabricating these devices using silicon substrates and wet etching to prevent substrate cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate separation methods are used, then chip separation is achieved, but burr formation and substrate cracking occur reducing reliability
Solution Approach 1:
An insulating support member is introduced as an intermediary between the light emitting structure layer and the substrate. This support member prevents direct mechanical stress transmission during chip separation, thereby preventing burr formation on the light emitting diodes while maintaining substrate integrity
Solution Approach 2:
The insulating support member is positioned in advance to cushion and distribute mechanical stress during the chip separation process. This pre-positioned protective structure prevents harmful burr formation and substrate cracking before they can occur
2Manufacturing precision
If conventional conductive layer structure is used, then device structure is simple, but adhesion is insufficient leading to alignment issues
Solution Approach 1:
The conductive layer is segmented into multiple distinct layers with different functions: a first conductive layer for electrical connection and a second conductive layer for mechanical adhesion. This segmentation improves alignment precision by ensuring proper bonding while maintaining electrical functionality
Solution Approach 2:
Different regions of the conductive layer structure are assigned different qualities - the first conductive layer provides electrical conductivity for electrode connection, while the second conductive layer provides enhanced mechanical adhesion to the light emitting structure layer, achieving both electrical and mechanical requirements
Data Source
AI summary
Provided is a light emitting device. The light emitting device includes a light emitting structure layer including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode electrically connected to the first conductive type semiconductor layer, an insulating support member under the light emitting structure layer, and a plurality of conductive layers between the light emitting structure layer and the insulating support member. At least one of the plurality of conductive layers has a width greater than that of the light emitting structure layer and includes a contact part disposed further outward from a sidewall of the light emitting structure layer.