Light Emitting Device Insulation Support Thermal Stress
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current light emitting devices face challenges in achieving high heat radiation efficiency and mechanical stability, particularly in high-output applications, where heat generation and thermal stress can lead to defects and failures due to the limitations of existing substrate separation methods and packaging technologies.
Innovation Solution
A light emitting device design that includes a support member with wide pads to enhance heat radiation, uses a stress buffering layer for mechanical stability, and incorporates a unique bulk electrode and insulation support structure to prevent short circuits and improve reliability, allowing direct mounting on printed circuit boards without metal diffusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the growth substrate is separated in a wafer level to improve heat radiation efficiency, then heat radiation efficiency is improved, but mechanical stability deteriorates due to thermal stress and potential defects
Solution Approach 1:
The device is divided into separate functional layers including the light emitting structure, support member, stress buffering layer, and insulation support. This segmentation allows each layer to independently perform its function - the support member provides mechanical stability while the separated growth substrate enables heat radiation, resolving the contradiction between heat radiation efficiency and mechanical stability
Solution Approach 2:
A stress buffering layer is introduced as an intermediary between the light emitting structure and the support member. This intermediate layer specifically addresses thermal stress by absorbing and distributing mechanical stresses, preventing defects while maintaining the benefits of substrate separation for heat radiation
2Temperature
If wide pads are used to enhance heat radiation, then heat radiation efficiency is improved, but the risk of short circuit between pads increases
Solution Approach 1:
An insulation support is introduced as an intermediary structure between the wide pads. This insulation support physically separates the pads while allowing them to maintain wide dimensions for heat radiation, preventing short circuits through metallic element diffusion while preserving thermal performance
3Device complexity
If direct mounting on printed circuit board is implemented, then device complexity is reduced, but metal diffusion from solder paste causes short circuits
Solution Approach 1:
The insulation support serves as a protective intermediary between the bulk electrodes and the solder paste. It allows direct mounting on the printed circuit board (maintaining simplicity) while preventing metal diffusion that would cause short circuits (maintaining reliability)
Solution Approach 2:
The insulation support provides self-protection functionality by inherently preventing metal diffusion without requiring additional protective layers or complex mounting procedures. The structure serves its own protection needs, maintaining both simplicity and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat radiation efficiency, mechanical stability, and reliability by preventing short circuits and reducing thermal stress, enabling the use of light emitting devices in high-output applications with enhanced performance and reduced failure rates.
Implementation Method 1
electrodes of the flip-chip type light emitting device are directly bonded to a secondary substrate... heat can be effectively conducted to the secondary substrate
Implementation Method 2
the first bulk electrode includes a protrusion part protruding from a side surface of the first bulk electrode toward the second bulk electrode, and the second bulk electrode includes a concave part depressed from a side surface of the second bulk electrode
Implementation Method 3
an insulation support covering side surfaces of the first and second bulk electrodes... preventing diffusion of a metallic element in the solder paste
Implementation Method 4
a stress buffering layer disposed on or over the insulating layer
Data Source
AI summary
Disclosed herein is a light emitting device manufactured by separating a growth substrate in a wafer level. The light emitting device includes: a base; a light emitting structure disposed on the base; and a plurality of second contact electrodes disposed between the base and the light emitting structure, wherein the base includes at least two bulk electrodes electrically connected to the light emitting structure and an insulation support disposed between the bulk electrodes and enclosing the bulk electrodes, the insulation support and the bulk electrodes each including concave parts and convex parts engaged with each other on surfaces facing each other, and the convex parts including a section in which a width thereof is changed in a protrusion direction.