LED Illuminant Device Integrated Circuit Board Design

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional LED lamp manufacturing processes are complex and time-consuming, with a large volume due to the separate circuit boards and modules, limiting the reduction of the housing size and increasing assembly time.

Innovation Solution

An illuminant device design that integrates LEDs and the controlling and driving module directly onto a single circuit board, eliminating the need for a separate circuit board for the driving module, allowing for reduced volume and simplified assembly through die attachment and wire bonding procedures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate circuit boards are used for LEDs and controlling module, then reliability is improved through modular design, but device complexity increases and manufacturing time is extended

Engineering Contradiction:
ImprovereliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates the controlling module and LED mounting onto a single circuit board, eliminating the need for separate circuit boards and reducing assembly steps. This merging approach reduces device complexity and manufacturing time while maintaining functional reliability through unified electrical connections and simplified assembly procedures

Inventive Principle:
Principle #5Merging (Combining)

2Ease of repair

If separate circuit boards are used for LEDs and controlling module, then ease of repair is improved through modularity, but manufacturing time is extended

Engineering Contradiction:
Improveease of repairVSAvoidmanufacturing time
Core Design Contradiction:
Ease of repairVSLoss of time

Solution Approach 1:

The integrated circuit board design combines controlling module and LED mounting into one unit, reducing the number of assembly operations required during manufacturing. This approach significantly reduces manufacturing time while maintaining repairability through standardized component placements and accessible circuit board design

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If predestinated volume of controlling module is used, then reliability is maintained through standardized design, but volume of housing cannot be reduced

Engineering Contradiction:
ImprovereliabilityVSAvoidvolume of housing
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent integrates the controlling module directly onto the LED circuit board, eliminating the need for a separate predestinated module housing. This integration allows for optimized space utilization and significant reduction in overall housing volume while maintaining the functional integrity and reliability of the controlling circuitry

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The controlling module components are arranged in a compact layout on the circuit board plane, utilizing two-dimensional space optimization. This dimensional arrangement allows for reduced overall volume by distributing components across the circuit board surface rather than requiring three-dimensional module stacking

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9297501B2Illuminant device
Publication Date: 2016.03.29 ENNOSTAR CORP
  • US9297501B2 patent drawing
  • US9297501B2 patent drawing
  • US9297501B2 patent drawing

AI summary

An illuminant device includes a housing, a circuit board, a plurality of LED dies, a light-transmitting layer, a controlling and driving module and a conductive connector. One end of the housing has a carrying part. The circuit board is disposed on the carrying part and has a circuit layer. The LED dies are placed on the circuit board and electrically connected to the circuit layer. The light-transmitting layer is circularly disposed on the circuit board and covering the LED dies. The controlling and driving module is placed on the circuit board and electrically connected to the circuit layer. The conductive connector is assembled with the other end of the housing and electrically connected to the circuit layer.