LED Integrated Packaging Module with Bowl-Shaped Reflective Cups
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Solution Overview
Problem
Current LED packaging modules with high color temperature struggle to achieve low color temperature and high color rendering properties while maintaining stability and efficient heat dissipation, leading to unsuitable luminous efficacy and reliability.
Innovation Solution
An LED integrated packaging light source module with a substrate featuring a 2:1 ratio of blue to red LED chips and a mixed colloid of yellow and green fluorescent powders, where bowl-shaped reflective cups enhance light emission and heat dissipation, using a substrate like aluminum or copper, and a hemispherical transparent silica gel for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a blue light LED chip is used to excite YAG fluorescent powder to obtain yellow light and mix with blue light to create white light, then luminous efficacy is improved, but color rendering property deteriorates at low color temperature
Solution Approach 1:
The patent combines multiple light sources (blue LED chips and red LED chips) and multiple fluorescent powders (YAG and red fluorescent powder) into a single integrated packaging module. This merging allows the system to simultaneously achieve high luminous efficacy from the blue-YAG combination and improved color rendering from the added red light component, resolving the contradiction between these two parameters.
Solution Approach 2:
The patent uses a composite fluorescent material system consisting of YAG fluorescent powder and red fluorescent powder together. This composite approach allows the material to simultaneously provide the high efficacy yellow light from YAG and the red light component needed for better color rendering, thus resolving the contradiction between luminous efficacy and color rendering property.
2Reliability
If red fluorescent powder is added to yellow fluorescent powder to increase red component, then color rendering index is improved, but luminous flux loss increases
Solution Approach 1:
The patent introduces red LED chips as an intermediary light source that directly emits red light without requiring red fluorescent powder conversion. This intermediary approach provides the necessary red light component for improved color rendering while avoiding the significant luminous flux loss that occurs when using red fluorescent powder excited by blue light.
3Reliability
If white-light LED and red-light LED are packaged together, then color rendering is improved, but heat affects red-light LED chip stability
Solution Approach 1:
The patent segments the LED chips into separate reflective cups, with blue LED chips in some cups and red LED chips in others. This spatial segmentation allows for independent thermal management of each chip type, protecting the red-light LED chips from the high heat generated by blue LED chips while maintaining the integrated packaging structure that provides good color rendering.
4Use of energy by moving object
If blue LED chips generate high heat, then luminous efficacy is maintained, but red-light LED chip reliability deteriorates
Solution Approach 1:
The patent divides the packaging into separate reflective cups, placing blue LED chips and red LED chips in different locations. This segmentation enables independent thermal management where blue LED chips can operate at high temperatures for maintaining luminous efficacy while red LED chips are protected from excessive heat, preserving their reliability.
Solution Approach 2:
The patent introduces heat dissipation structures (reflective cups with specific thermal properties) as intermediaries between the heat-generating blue LED chips and the heat-sensitive red LED chips. These intermediaries manage thermal transfer to maintain luminous efficacy from the blue chips while protecting the red chips from thermal damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module generates white light with a low color temperature and high color rendering property, offering enhanced luminous efficacy and stability by effectively managing heat dissipation and light emission, making it suitable for common lighting applications.
Implementation Method 1
a mixed colloid of yellow and green fluorescent powders is coated on the blue light LED chip
Implementation Method 2
The LED integrated packaging light source module generates yellow-green light by exciting a yellow-green fluorescent powder with blue light emitted by a blue light LED chip
Implementation Method 3
a plurality of bowl-shaped reflective cups is disposed on the substrate, a blue light LED chip or a red-light LED chip is disposed inside each reflective cup
Implementation Method 4
The bowl-shaped reflective cups set on a substrate, on one aspect, enhance the light emission efficiencies of the blue light LED chip and the red-light LED chip, and on another aspect, improve the heat dissipation of the blue light LED chip
Data Source
AI summary
An LED integrated packaging light source module is provided, which includes a substrate, a plurality of bowl-shaped reflective cups is disposed on the substrate, a blue light LED chip or a red-light LED chip is disposed inside each reflective cup, the ratio between the number of the blue light LED chips and the number of the red-light LED chips on the substrate is 2:1, and a mixed colloid of yellow and green fluorescent powders is coated on the blue light LED chip. In the LED integrated packaging light source module, the bowl-shaped reflective cups set on a substrate, on one aspect, enhance the light emission efficiencies of the blue light LED chip and the red-light LED chip, and on another aspect, improve the heat dissipation of the blue light LED chip, so as to prevent the heat generated by the blue light LED chip from affecting the red-light LED chip, thereby enhancing the reliability of the entire integrated packaging light source module.