LED Package Inter-Digit Electrode Offset Structural Integrity
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Solution Overview
Problem
Existing LED packages lack enhanced structural integrity, as none of the prior art configurations provide substantial improvements in this aspect.
Innovation Solution
The LED package features a lead frame with inter-digit electrodes that are spaced apart to form an inter-digit region, which is offset relative to the housing dimensions, providing increased structural integrity through various configurations such as single-step, double-step, or multi-step designs, and varying electrode areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional parallel inter-digit electrode configurations are used, then the device complexity is low and manufacturing is simple, but the structural integrity is insufficient
Solution Approach 1:
The patent applies asymmetry by offsetting the inter-digit electrode region from the center of the housing. The electrode configuration is positioned asymmetrically within the housing, creating an offset arrangement that enhances structural integrity while maintaining manufacturability. This asymmetric positioning allows for improved mechanical support and reduced stress concentration points in the package structure.
2Strength
If the inter-digit region length is increased to improve structural integrity, then the structural robustness improves, but the area occupied by electrodes increases
Solution Approach 1:
The patent utilizes dimensional optimization by carefully controlling the length of the inter-digit electrode region along the housing axis. Instead of simply increasing electrode area, the invention optimizes the distribution and positioning of electrodes along the length of the housing, achieving enhanced structural integrity through strategic dimensional placement rather than increased material quantity.
3Strength
If various electrode configurations (single-step, double-step, multi-step) are implemented to enhance structural integrity, then the structural robustness improves, but the manufacturing precision requirements increase
Solution Approach 1:
The patent applies segmentation by dividing the electrode structure into distinct steps (single-step, double-step, or multi-step configurations). These segmented electrode regions are positioned at different locations along the housing, allowing for modular manufacturing approaches. Each step can be fabricated and positioned independently, which helps manage manufacturing precision requirements while achieving the desired structural robustness through the segmented arrangement.
Data Source
AI summary
A light emitting diode package including: a housing, wherein the housing has a first axis defined as a width (w), and a second axis defined as a height (h); a lead frame associated with the housing, wherein the lead frame includes a first electrode and a second electrode; wherein the first electrode and the second electrode are spaced apart from each other to define an inter-digit region therebetween, wherein the inter-digit region comprises a length (l) that is offset (e.g., not parallel) relative to the width and/or height of the housing.