Light Emitting Device Interlayer Wiring Heat Dissipation
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Solution Overview
Problem
Existing light emitting devices experience non-uniform heat dissipation, leading to inefficient heat management and potential deterioration of light emitting elements.
Innovation Solution
A light emitting device design featuring a mounting board with strategically arranged interlayer wiring parts and heat dissipation terminals, which electrically connect front and back face wiring parts to facilitate uniform heat dissipation across the device, using a ceramic insulator and conductive materials like copper for enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If vias are provided to connect front and back faces of the mounting board for heat dissipation, then heat dissipation speed is improved, but heat dissipation uniformity deteriorates
Solution Approach 1:
The patent divides the heat dissipation function into multiple segments: front face wiring parts, back face terminals, first interlayer wiring parts penetrating the insulator, and second interlayer wiring parts embedded in the insulator. This segmentation creates multiple heat dissipation pathways that distribute heat more uniformly throughout the mounting board, preventing localized heat concentration while maintaining efficient heat removal.
Solution Approach 2:
The patent transitions from two-dimensional surface mounting to three-dimensional interlayer wiring architecture. By embedding second interlayer wiring parts within the insulator thickness and combining them with penetrating first interlayer wiring parts, the design creates vertical heat dissipation pathways through the insulator, adding a depth dimension to heat management and achieving both speed and uniformity.
2Illumination intensity
If high luminance light emitting elements are used, then light output is improved, but heat generation increases
Solution Approach 1:
The patent introduces the mounting board with its multi-layer wiring structure as an intermediary between the high luminance light emitting elements and the external environment. The conductive wiring parts embedded in the insulator act as heat transfer mediators, conducting heat away from the light emitting elements through multiple pathways, thereby enabling high luminance operation without excessive temperature rise.
Solution Approach 2:
The patent employs a composite structure combining the insulator material with conductive wiring parts (such as copper or other heat-conductive materials). This composite architecture provides both electrical insulation and thermal management capabilities, allowing high luminance elements to operate while the conductive components efficiently conduct generated heat to dissipation points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves more uniform heat dissipation, reducing the risk of element deterioration and improving the overall efficiency of heat management in light emitting devices.
Implementation Method 1
first interlayer wiring parts penetrating the insulator and electrically connecting the front face wiring parts and the back face terminals, and one or more second interlayer wiring parts embedded in the insulator to be in contact with the connection wiring part
Data Source
Figure 1A~1C
Figure 2A~2C
Figure 3A~3C
AI summary
A light emitting device includes a mounting board, a first light emitting element and a second light emitting element. The mounting board includes an insulator which includes a front face and a back face, a pair of front face wiring parts disposed on the front face of the insulator, a connection wiring part disposed on the front face of the insulator and spaced apart from the front face wiring parts, a pair of back face terminals disposed on the back face of the insulator, first interlayer wiring parts penetrating the insulator and electrically connecting the front face wiring parts and the back face terminals, and one or more second interlayer wiring parts embedded in the insulator to be in contact with the connection wiring part, and spaced apart from the back face terminals.