Thermally Conductive Interposer for LED Heat Extraction

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Solution Overview

Problem

The brightness and lifespan of LEDs are limited by their inability to efficiently dissipate heat, as increased current leads to overheating, reducing efficiency and shortening their lifespan.

Innovation Solution

A thermally conductive interposer is attached to the top of the LED to facilitate heat flow away from the device, acting as a heat sink to dissipate heat and allow for increased current usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If increased current is applied to the LED to increase brightness, then the brightness increases, but the heat generation increases and reduces LED efficiency and lifespan

Engineering Contradiction:
ImprovebrightnessVSAvoidheat
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The patent extracts the heat dissipation function from the traditional LED mounting structure by introducing a separate thermally conductive interposer layer between the LED and the heat sink. This interposer specifically extracts heat from the LED's active region through its high thermal conductivity, allowing the LED to operate at higher currents for increased brightness without excessive temperature rise.

Inventive Principle:
Principle #2Taking out (Extraction)

2Illumination intensity

If increased current is applied to the LED to increase brightness, then the brightness increases, but the LED lifespan decreases due to overheating

Engineering Contradiction:
ImprovebrightnessVSAvoidlifespan
Core Design Contradiction:
Illumination intensityVSDuration of action of stationary object

Solution Approach 1:

The patent introduces a thermally conductive interposer layer as an intermediary between the LED and the heat sink. This interposer with high thermal conductivity acts as a thermal mediator that efficiently transfers heat away from the LED's active region, enabling the LED to sustain higher operating currents for increased brightness while maintaining acceptable operating temperatures for extended lifespan.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If traditional heat sink mounting is used, then the structure is simple, but the heat dissipation efficiency is insufficient

Engineering Contradiction:
ImprovestructureVSAvoidheat dissipation efficiency
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The patent employs a composite structure consisting of multiple layers with different functional properties: a thermally conductive interposer layer (made of materials such as diamond, cubic silicon carbide, or amorphous silicon) is placed between the LED and the heat sink. This composite material approach optimizes heat dissipation by combining the high thermal conductivity of the interposer with the heat sinking capability of the heat sink, significantly improving heat dissipation efficiency compared to direct mounting.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances the brightness and longevity of LEDs by effectively managing heat, enabling them to handle higher currents without overheating.

Implementation Method 1

Heat can flow through the top of the LED and into the interposer. The interposer can carry the heat away from the LED.

Methodology Applied
Scientific EffectHeat flow: Conduction (thermal)

Implementation Method 2

The interposer can carry the heat away from the LED... functions as a heat sink and thus dissipates the heat

Methodology Applied
Scientific EffectHeat sink: Heat Sink

Data Source

PatentUS7892870B2Thermal management for LED
Publication Date: 2011.02.22 BRIDGELUX INC
  • US7892870B2 patent drawing
  • US7892870B2 patent drawing
  • US7892870B2 patent drawing

AI summary

A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can flow through the top of the LED and into the interposer. The interposer can carry the heat away from the LED. Light can exit the LED though an at least partially transparent substrate of the LED. By removing heat from an LED, the use of more current through the LED is facilitated, thus resulting in a brighter LED.