LED Display Interposer Pixel Modules for Faster Assembly Repair
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Solution Overview
Problem
The miniaturization of semiconductor light emitting elements poses challenges in the transfer process for large-sized displays, particularly with the pick & place method, which is time-consuming and prone to defects, and makes it difficult to replace individual defective elements, leading to reduced manufacturing yield and repair efficiency.
Innovation Solution
A display device using a unit structure with multiple pixels integrated on an interposer, connected to a wiring substrate and controlled by an IC chip, which reduces the need for individual pick & place processes, minimizes defects, and allows for easier replacement and repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual semiconductor light emitting elements are transferred using pick & place process, then high resolution display can be achieved, but the manufacturing time increases significantly
Solution Approach 1:
The patent segments the transfer process by grouping multiple semiconductor light emitting elements onto a single carrier substrate, creating modular units that can be transferred together rather than individually. This segmentation maintains high resolution by ensuring precise placement of each element within the module while reducing the total number of transfer operations required.
Solution Approach 2:
The patent combines multiple semiconductor light emitting elements into a single integrated module on a carrier substrate. By merging these elements into a unified transfer unit, the system reduces the number of separate pick & place operations needed, thereby decreasing manufacturing time while maintaining the individual positioning precision of each element through the module's internal arrangement.
2Manufacturing precision
If individual semiconductor light emitting elements are transferred using pick & place process, then precise positioning can be achieved, but coupling defects increase
Solution Approach 1:
The patent segments the transfer process into module-level and element-level operations. By first transferring complete modules with pre-arranged elements to the display substrate, the system reduces the number of critical coupling points. The internal positioning within modules is established during module fabrication, ensuring precise positioning while minimizing opportunities for coupling defects during the final transfer stage.
Solution Approach 2:
The patent performs preliminary arrangement and positioning of semiconductor light emitting elements on the carrier substrate before the final transfer to the display substrate. This preliminary action ensures precise positioning is achieved during module fabrication rather than during the critical transfer process, thereby reducing coupling defects while maintaining high positioning accuracy in the final assembly.
3Manufacturing precision
If individual semiconductor light emitting elements are used, then high resolution can be achieved, but replacement of defective elements becomes difficult
Solution Approach 1:
The patent segments the display into replaceable modules, each containing multiple semiconductor light emitting elements arranged in a specific pattern. This segmentation enables replacement of entire modules rather than individual elements, maintaining high resolution through the modular design while dramatically simplifying the repair process. Defective modules can be quickly identified and replaced as complete units, preserving the high-resolution display quality.
Solution Approach 2:
The patent implements a module replacement strategy where defective modules are discarded and replaced with new or refurbished modules rather than attempting to repair individual elements within them. This approach maintains high resolution by ensuring replaced modules meet the same precision standards, while significantly improving ease of repair by simplifying the replacement process to a single module-level operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time required for assembly, decreases defects, increases manufacturing yield and repair efficiency, enhances the flexibility and reduces the thickness of the display device.
Implementation Method 1
A light emitting diode (LED) is a well-known semiconductor light emitting element that converts current into light
Data Source
AI summary
The present invention relates to a display device, using semiconductor light-emitting diodes, comprising: a wiring board which comprises a row line for providing a row signal, a column line for providing a column signal, a VCC line connected to a VCC input terminal, and a VDD line connected to a VDD input terminal; and an interposer which is provided on the wiring board, has pixels, comprising semiconductor light-emitting diodes, along a plurality of rows and columns, and comprises IC chips for controlling the pixel light emission. The interposer comprises: a first terminal connected to the row line and for transmitting the row signal to the IC chips; a second terminal connected to the column line and for transmitting the column signal to the IC chips; a third terminal connected to the VCC line and connecting the VCC input terminal and the IC chips; and a fourth terminal connected to the VDD line and connecting the VDD input terminal and the IC chips.