LED Lamp Assembly Thermal Management via Forced Air Convection

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Solution Overview

Problem

High-power LEDs in lamp assemblies face heat management issues when housed in non-metallic materials, leading to potential overheating, burnout, or fire, as these materials do not conduct heat effectively, and existing solutions like metal housings are inadequate for thermal management.

Innovation Solution

A lamp assembly design incorporating a high-power LED mounted on a heat sink with a fan that draws air away from the LED, allowing for effective cooling and using a wider range of materials, including non-metallic ones, by creating a cooling air current through holes in the heat sink and housing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a single high-power LED is used in a lamp assembly, then light output and energy efficiency are improved, but heat generation increases causing the LED to overheat and burn out

Engineering Contradiction:
Improvelight outputVSAvoidLED operating temperature
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The patent employs a fan to generate forced air convection, drawing cool air through the heat sink and expelling hot air from the lamp assembly. This pneumatic approach actively manages heat removal, enabling the LED to operate at high power levels without overheating by maintaining safe operating temperatures through continuous air flow.

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Temperature

If metal housing is used to conduct heat away from the LED, then thermal management is improved, but design flexibility and decorative options are limited

Engineering Contradiction:
Improveheat conductionVSAvoidmaterial selection
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The patent introduces a heat sink as an intermediary component between the LED and the housing. The heat sink, made from thermally conductive material, is attached to the LED to conduct heat away, while the housing can be made from any material (metal, glass, plastic) for decorative purposes. This intermediary approach decouples the thermal management function from the housing material selection, allowing both effective heat conduction and design flexibility.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If several low-power LEDs are used instead of a single high-power LED, then heat generation is reduced making cooling easier, but light output and energy efficiency decrease

Engineering Contradiction:
Improvepower densityVSAvoidlight output
Core Design Contradiction:
TemperatureVSIllumination intensity

Solution Approach 1:

The patent uses forced air convection through a fan to efficiently remove heat from the high-power LED. By creating active air flow through the heat sink structure, the system can handle the high power density of a single LED without requiring multiple LEDs, thus maintaining high light output and energy efficiency while effectively managing thermal loads.

Inventive Principle:
Principle #29Pneumatics and hydraulics

4Adaptability or versatility

If non-metallic materials are used for the housing, then design flexibility and decorative options are improved, but heat conduction capability deteriorates leading to heat buildup

Engineering Contradiction:
Improvematerial selectionVSAvoidheat conduction
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent employs a heat sink as an intermediary component that handles all thermal conduction tasks. The heat sink is directly attached to the LED to conduct heat away, while the housing can be made from any material including non-metallic options like glass or plastic for decorative purposes. This separates the thermal management function from the housing material requirements, allowing both effective heat conduction and design flexibility.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent uses forced air convection to compensate for the poor thermal conduction of non-metallic housing materials. The fan creates active air flow that carries heat away from the LED and heat sink, allowing the housing to be made from decorative non-metallic materials without suffering from heat buildup issues that would occur with passive conduction alone.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the operating temperature of the LED from 100°C to 40°C, extending its lifespan and energy efficiency, while allowing the use of various materials and reducing component count by powering the LED and fan from a single supply.

Implementation Method 1

at least one fan adapted to produce a current of air to cool the light source; wherein the fan is arranged to draw air away from the light source and eject it from the mounting

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

the light source is mounted on a heat sink, the heat sink having at least one hole or being otherwise permeable to allow air flow through it

Methodology Applied
Scientific EffectThermal Conduction: Conduction (thermal)

Data Source

PatentUS8186856B2Thermally managed lamp assembly
Publication Date: 2012.05.29 TAHMOSYBAYAT GHOLLAM
  • US8186856B2 patent drawing
  • US8186856B2 patent drawing
  • US8186856B2 patent drawing

AI summary

A lamp assembly comprises at least one light source such as a high-power LED (106), a housing (heat sink (108), metal base (109) with holes (126), lens (118)) in or on which the light source is located, and a fan (120) adapted to produce a current of air to cool the light source. The fan is arranged to draw air away from the light source through the holes (126) and to eject it from the housing; to this end the fan is preferably located directly underneath the light source in a self-contained package.