Incandescent Bulb LED Lamp Heat Dissipation via Conduction
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Solution Overview
Problem
The durability of LED lamps is significantly reduced due to heat generated from the LED module and power supply, leading to issues like wire breakage and defective components, especially in sealed incandescent bulb structures where thermal convection limits effective heat dissipation.
Innovation Solution
Incorporating a heat conduction member, such as heat-dissipating silicon, within the internal space of the base and PCB to efficiently dissipate heat generated from the LED module and power supply unit to the outside through the base, rather than relying on thermal convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal convection is used for heat dissipation in sealed incandescent bulb structures, then the structure remains simple and sealed, but heat dissipation efficiency is insufficient leading to reduced durability
Solution Approach 1:
A heat conduction member (silicon-based material) is introduced as an intermediary substance between the LED module and the base to facilitate efficient heat transfer. This mediator enables effective heat dissipation through conduction while maintaining the sealed structure integrity, resolving the contradiction between structural simplicity and heat dissipation efficiency.
Solution Approach 2:
The patent changes the heat dissipation mechanism from convection (inefficient in sealed structures) to conduction (efficient through solid contact). By introducing a silicon-based heat conduction member with high thermal conductivity, the heat transfer parameter is optimized, enabling effective heat dissipation while maintaining the sealed bulb structure.
2Loss of energy
If expensive heat dissipation devices are used to improve heat dissipation, then heat dissipation efficiency increases, but production cost increases and production efficiency decreases
Solution Approach 1:
The patent uses a relatively simple silicon-based heat conduction member instead of complex expensive heat dissipation devices. This cost-effective solution provides sufficient heat dissipation performance without requiring sophisticated equipment, thereby maintaining high production efficiency and low manufacturing costs.
Solution Approach 2:
By changing the heat dissipation approach from requiring complex active cooling devices to using a passive silicon-based conduction member, the patent achieves effective heat dissipation with simpler, cheaper components that can be easily integrated during standard production processes.
3Loss of energy
If the internal space is filled with heat conduction member, then heat dissipation efficiency increases, but device complexity increases
Solution Approach 1:
The silicon-based heat conduction member serves multiple functions: it provides thermal conduction for heat dissipation, fills the internal space efficiently, and can be integrated into the existing base structure. This multi-functionality achieves effective heat dissipation without significantly increasing structural complexity.
Solution Approach 2:
The heat conduction member is designed to homogeneously fill the internal space, creating a uniform thermal conduction path from the LED module through the base. This homogeneous distribution simplifies the overall structure by replacing complex multi-component heat dissipation systems with a single uniform material filling approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the durability of the LED lamp by maximizing heat dissipation via conduction, reducing production costs by eliminating the need for expensive heat dissipation devices and maintaining the existing production equipment and structure, thereby improving production efficiency.
Implementation Method 1
a heat conduction member that is filled in an internal space formed by an inner surface of the base and a printed circuit board (PCB) of the power supply unit and configured to dissipate heat generated from the LED module and the power supply unit to the outside through the base
Data Source
AI summary
This application relates to an incandescent bulb-type LED lamp having a heat dissipation function. In one aspect, the LED lamp includes a globe forming an external shape of the lamp, and an LED module supported by a stem in which a gas injection portion is formed and installed inside the globe. The LED lamp may also include a power supply unit for supplying power to the LED module, and a base bonded to one side of the globe and connected to a socket to supply commercial power to the power supply unit. The LED lamp may further include a heat conduction member filled in an internal space formed by an inner surface of the base and a printed circuit board (PCB) of the power supply unit and configured to dissipate heat generated from the LED module and the power supply unit to the outside through the base.