Vehicle LED Lamp Direct Heat Sink Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional vehicle LED lamp apparatuses face productivity and cost issues due to the need for separate electrode connection processes and inefficient heat transfer, leading to increased thermal resistance and larger heat sinks.
Innovation Solution
The LED lamp apparatus features a heat sink with an LED mounted directly between the heat sink and the printed circuit board, utilizing an electrode binder to electrically connect the LED, allowing for simultaneous surface mounting and reducing thermal resistance by direct heat transfer to the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LEDs are mounted on a printed circuit board with separate wire bonding or wedge bonding processes, then electrical connection is achieved, but productivity is lowered and process costs are increased
Solution Approach 1:
The patent combines the electrical connection function and mechanical mounting function into a single electrode binder component. The electrode binder simultaneously provides electrical connectivity between the LED and PCB while serving as the mounting structure, eliminating the need for separate wire bonding or wedge bonding processes and enabling direct placement mounting that improves productivity.
Solution Approach 2:
The electrode binder is designed to perform multiple functions: it provides electrical connection between the LED electrodes and PCB traces, serves as a mechanical mounting structure to secure the LED, and acts as an adhesive to bond the LED to the PCB. This multi-functional component replaces multiple separate components and processes.
2Temperature
If heat is transferred from LEDs through the printed circuit board to a heat sink, then cooling is achieved, but heat transfer efficiency is lowered and heat sink size is increased
Solution Approach 1:
The patent extracts the heat transfer path from the conventional route through the PCB and creates a dedicated direct thermal path from the LED to the heat sink. The electrode binder is positioned to conduct heat directly from the LED to the heat sink, bypassing the PCB and reducing thermal resistance, which allows for a smaller heat sink volume.
Solution Approach 2:
The electrode binder serves as a thermal intermediary that facilitates direct heat transfer from the LED to the heat sink. By positioning the electrode binder in direct contact with both the LED and the heat sink, it creates an efficient thermal conduction path that improves heat dissipation efficiency and reduces the required heat sink size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes thermal resistance, enables heat sink miniaturization, and improves productivity by eliminating the need for separate electrode connection processes, resulting in cost reduction and enhanced cooling performance.
Implementation Method 1
heat released from LEDs is transferred to a heat sink through the printed circuit board
Implementation Method 2
an electrode binder extending to the LED through the printed circuit board and electrically connecting the printed circuit board and the LED
Data Source
AI summary
Disclosed herein is an LED lamp apparatus for a vehicle, which includes a heat sink, a printed circuit board including an electric circuit and disposed on the heat sink, an LED disposed between the heat sink and the printed circuit board, the LED being in contact with the heat sink, and an electrode binder extending to the LED through the printed circuit board and electrically connecting the printed circuit board and the LED.