Three-Region LED Lamp Surface With Dual Heat Dissipation Channels

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Solution Overview

Problem

High-power LED lamps face significant challenges with heat dissipation, leading to reduced lighting efficiency and shortened lifespan due to ineffective management of waste heat.

Innovation Solution

The LED lamp design incorporates a heat sink with fins and a base, along with a lamp shell and sleeve, featuring a first and second heat dissipating channel for air flow, and a light emitting surface with specific LED chip arrangements and reflecting surfaces to enhance heat transfer and light output.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If high-power LED lamps are used to increase lighting efficiency, then energy saving and brightness are improved, but heat dissipation becomes insufficient leading to reduced lifespan

Engineering Contradiction:
Improvelighting efficiencyVSAvoidlifespan
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The light emitting surface is divided into three distinct regions (first, second, and third regions) with different LED chip arrangements and inclinations. This segmentation allows different areas to serve different functions: some regions optimize for light output while others prioritize heat dissipation pathways, resolving the contradiction between lighting efficiency and heat management for lifespan extension

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the light emitting surface are designed with different local characteristics - the first region has LED chip sets inclined at specific angles for optimal light direction, the second region has different inclination for heat dissipation, and the third region has yet another configuration. This local quality variation allows simultaneous optimization of lighting efficiency in some areas and heat dissipation in others, thereby extending lifespan

Inventive Principle:
Principle #3Local quality

2Reliability

If heat dissipation structures are added to manage waste heat, then lifespan is improved, but device complexity increases

Engineering Contradiction:
ImprovelifespanVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The heat dissipation function is merged into the light emitting surface itself by creating multi-region structures where LED chip arrangements serve dual purposes: light emission and heat dissipation. The reflecting surfaces are also integrated to redirect both light and facilitate heat away from the LED chips, reducing the need for separate complex heat dissipation components while extending lifespan

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The light emitting surface structure is designed to perform multiple functions simultaneously - it emits light, dissipates heat, and protects LED chips. The three-region configuration with different LED chip inclinations allows the same structural element to serve both lighting and thermal management functions, improving lifespan without significantly increasing device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If LED chip sets are arranged in multiple regions with different inclinations, then heat dissipation is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveheat dissipationVSAvoidchip arrangement precision
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The light emitting surface is segmented into three regions, each with standardized LED chip arrangements and inclinations. This segmentation allows for modular manufacturing where each region can be assembled with standard precision requirements, avoiding the need for extremely high precision across the entire surface while still achieving effective heat dissipation through the collective arrangement of all regions

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively dissipates heat through natural convection and radiation, improving the LED lamp's efficiency and lifespan by balancing heat dissipation with light output, ensuring better thermal management and illuminance.

Implementation Method 1

a heat transferring path from the LED chips to the passive heat dissipating element

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

This design effectively dissipates heat through natural convection and radiation

Methodology Applied
Scientific EffectNatural convection: Free Convection

Implementation Method 3

This design effectively dissipates heat through natural convection and radiation

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS10677440B2LED lamp with light emitting surface having first region, second region and third region
Publication Date: 2020.06.09 JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO LTD
  • US10677440B2 patent drawing
  • US10677440B2 patent drawing
  • US10677440B2 patent drawing

AI summary

An LED lamp includes: a lamp shell including a lamp head, a lamp neck and a sleeve; a passive heat dissipating element having a heat sink connected to the lamp shell; a power source having a first portion and a second portion; a light emitting surface connected to the heat sink of the passive heat dissipating element and comprising LED chips electrically connected to the power source; a first heat dissipating channel formed in a first chamber of the lamp shell for dissipating heat generated from the power source while the LED lamp is working, and the first chamber is located between bottom of the LED lamp and an upper portion of the lamp neck; and a second heat dissipating channel formed in the heat sink and between the fins and the base of the heat sink for dissipating the heat generated from the LED chips and transferred to the heat sink; wherein the light emitting surface includes a first region, a second region located inside the first region in a radial direction of the LED lamp and a third region located outside the first region in the radial direction of the LED lamp, at least one LED chip set is located in the third region which inclines to the first region to form an angle, at least one LED chip set is located in the second region which inclines to the first region to form an angle.