LED Lamp Heat Sink Segmentation for Thermal Isolation

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Solution Overview

Problem

LED lighting systems face challenges in efficiently dissipating heat while maintaining a compact form factor to replace traditional incandescent and fluorescent lighting, as existing solutions often compromise on thermal management and electrical insulation.

Innovation Solution

The design incorporates a heat sink with a thermally conductive portion and a dissipating portion that is partially exposed to the ambient environment, featuring a plurality of fins to facilitate air flow and separate the lamp electronics from the LEDs, ensuring effective heat dissipation without conducting heat to the electronics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a compact form factor is used to replace traditional lighting, then the lamp can replace standard incandescent and fluorescent bulbs, but heat dissipation becomes insufficient leading to overheating of LEDs

Engineering Contradiction:
Improvelamp form factorVSAvoidLED operating temperature
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The heat sink is divided into two distinct portions: a thermally conductive portion that contacts the LEDs to collect heat, and a thermally dissipative portion with fins that exposes heat to ambient air for dissipation. This segmentation allows efficient heat transfer from the compact LED assembly to the enlarged dissipation surface, resolving the contradiction between compact form factor and adequate heat dissipation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat dissipation solution extends into the radial dimension by incorporating fins that protrude outward from the heat sink body. This dimensional extension increases the effective heat dissipation surface area without significantly increasing the axial length of the lamp, allowing compact form factor while maintaining adequate heat dissipation capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If a heat sink is added to cool the LEDs, then heat dissipation improves, but the complexity of the lamp structure increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidlamp structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat sink is merged with the lamp assembly as an integrated component rather than a separate attachment. The heat sink portions are positioned to work in conjunction with the LED assembly and enclosure, combining thermal management functionality with the existing lamp structure to minimize overall complexity while achieving effective heat dissipation.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The heat sink serves multiple functions: it provides thermal management for the LEDs, acts as a structural support element, and its finned portion creates radial air flow paths that also facilitate cooling of surrounding components. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in structural complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If the heat sink is positioned close to the LEDs for effective heat transfer, then heat dissipation efficiency improves, but heat may conduct to the lamp electronics causing damage

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidheat impact on electronics
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The heat sink's dissipative portion is extracted and positioned away from the electronics compartment, with fins that extend into the radial space between the LED assembly and the enclosure. This extraction allows the heat sink to collect heat efficiently from the LEDs while directing heat dissipation away from the sensitive electronics, preventing thermal damage.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The heat sink acts as an intermediary thermal management component positioned between the heat-generating LEDs and the heat-sensitive electronics. It intercepts heat from the LEDs through its conductive portion and redirects heat dissipation through its dissipative portion toward ambient air, mediating the thermal interaction to protect electronics while maintaining LED cooling efficiency.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for efficient heat dissipation, enabling the LEDs to operate at higher wattage while maintaining a compact form factor and preventing heat from adversely affecting the lamp electronics, thus enhancing the LED lamp's performance and longevity.

Implementation Method 1

A heat sink comprises a heat conducting portion that is thermally coupled to the at least one LED and a heat dissipating portion that is at least partially exposed to the ambient environment

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat dissipating portion is configured to allow air flow radially across the heat sink

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

The heat dissipating portion may comprise a plurality of fins. The plurality of fins may define a plurality of inner edges and the inner edges may be spaced from one another to define an interior open space

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS10030819B2LED lamp and heat sink
Publication Date: 2018.07.24 IDEAL IND LIGHTING LLC
  • US10030819B2 patent drawing
  • US10030819B2 patent drawing
  • US10030819B2 patent drawing

AI summary

A lamp has an at least partially optically transmissive enclosure and a base that retains lamp electronics. LEDs are located in the enclosure and are operable to emit light when energized through an electrical path from the base. The LEDs are thermally isolated from the lamp electronics in the base. A heat sink is disposed between the base and the enclosure. The heat sink includes a heat conducting portion that is thermally coupled to the LEDs and a heat dissipating portion that is exposed to the ambient environment. The heat dissipating portion includes fins that have inner edges and create spaces between adjacent ones of the fins. The inner edges are spaced from one another to define an interior open space where the interior open space communicates with the spaces between the fins.