LED Lamp Insulating Layer Heat Dissipation

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Solution Overview

Problem

Existing LED lamp constructions face challenges with heat dissipation and electrical isolation when using conductive substrates, leading to reduced light output and shortened lifespan, especially under high voltage AC or DC power operation.

Innovation Solution

The LED lamp is built with an electrically insulating layer epitaxially grown onto a substrate, allowing for the use of conductive, semi-conductive, or insulating substrates, reducing trench depth and enabling reliable interconnectivity between discrete LEDs, and incorporating thermally conductive substrates for efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conductive substrates are used for LED lamp construction, then heat dissipation is improved, but electrical isolation between discrete LEDs deteriorates

Engineering Contradiction:

Improveheat dissipationVSAvoidelectrical isolation

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The substrate surface is segmented into discrete LED regions separated by trenches. These trenches physically divide the conductive substrate into electrically isolated segments, allowing each LED to be electrically independent while maintaining thermal contact with the conductive substrate for heat dissipation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An insulating layer is introduced as an intermediary material filling the trenches between discrete LEDs. This insulating layer provides electrical isolation between adjacent LEDs while allowing the underlying conductive substrate to continue functioning as a heat sink for thermal management.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If deep trenches are etched for electrical isolation, then electrical isolation is improved, but manufacturing complexity and difficulty increase

Engineering Contradiction:

Improveelectrical isolationVSAvoidtrench fabrication

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The trench depth parameter is optimized to a moderate range that provides sufficient electrical isolation without requiring excessive etching depth. This parameter change balances electrical isolation requirements with manufacturing ease, avoiding the need for very deep trenches that would increase fabrication complexity.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

A composite structure is created by filling the etched trenches with insulating material. This composite approach combines the conductive substrate (for heat dissipation) with the insulating trench filler (for electrical isolation), achieving both functions with moderate trench depths rather than requiring extremely deep trenches for isolation.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If moderate trench depth is used, then ease of manufacture is improved, but electrical isolation may be insufficient

Engineering Contradiction:

Improvetrench fabricationVSAvoidelectrical isolation

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

Inventive Principle:

Principle #24Intermediary (Mediator)

4Ease of operation

If voltage down-conversion circuitry is used, then LED operation at low voltage is enabled, but device complexity increases

Engineering Contradiction:

ImproveLED voltage compatibilityVSAvoidcircuitry requirements

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

Multiple discrete LEDs are merged into a single integrated lamp structure with common electrical connections. The LED array is configured to operate directly from standard AC power lines through simple series/parallel connections, eliminating the need for separate voltage down-conversion circuitry by integrating the voltage adaptation function into the LED array configuration itself.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the reliability and performance of LED lamps by improving electrical isolation and heat dissipation, allowing for consistent high voltage AC or DC operation with reduced electrical resistance and increased light output.

Implementation Method 1

an electrically insulating layer epitaxially grown onto a substrate

Methodology Applied

Scientific EffectEpitaxy: Epitaxy

Implementation Method 2

incorporating thermally conductive substrates for efficient heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7525248B1Light emitting diode lamp

Publication Date: 2009.04.28 LED LIGHTING INC

AI summary

A LED based solid-state light emitting device or lamp is built upon an electrically insulating layer that has been formed onto a support surface of a substrate. Specifically, the insulating layer may be epitaxially grown onto the substrate, followed by an LED buildup of an n-type semiconductor layer, an optically active layer, and a p-type semiconductor layer, in succession. Isolated mesa structure of individual, discrete LEDs is formed by etching specific portions of the LED buildup down to the insulating layer, thereby forming trenches between adjacent LEDs. Thereafter, the individual LEDs are electrically coupled together through conductive elements or traces being deposited for connecting the n-type layer of one LED and the p-type layer of an adjacent LED, continuing across all of the LEDs to form the solid-state light emitting device.