LED Lamp with Integrated Driver and Bare Chip Mounting
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Solution Overview
Problem
LED lamps suffer from poor emission characteristics, reduced lighting quality due to flickering, smaller solid angle coverage, and bulkiness, primarily due to the size of driver electronics and heat sinks, which also reduce service life.
Innovation Solution
An LED lamp design with a glass bulb housing the light module and driver electronics, utilizing bare chip mounting of light-emitting diode chips on a printed circuit board within the glass bulb, and incorporating a smoothing capacitor to reduce flickering and improve emission characteristics, along with a thermally conductive gas and getter material to enhance heat dissipation and reduce volatile organic compound issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If driver electronics and heat sinks are included in LED lamps, then LED lamps can function properly, but the size of LED lamps increases making them bulky
Solution Approach 1:
The patent combines the driver electronics and heat dissipation functions within the compact LED light source housing. The driver electronics are integrated into the base structure, and the heat sink is designed as a compact component that works in conjunction with the LED chips, eliminating the need for separate bulky components while maintaining functional operation.
Solution Approach 2:
The patent employs a nested arrangement where the LED chips are mounted on a substrate that is itself mounted on the heat sink structure. The driver electronics are integrated into the base housing, creating a compact nested configuration that minimizes overall volume while accommodating all necessary functional components.
2Ease of manufacture
If LED light sources are compact, then production cost is reduced, but cooling performance deteriorates reducing service life
Solution Approach 1:
The patent applies local quality optimization by designing the heat sink with enhanced thermal conductivity materials and optimized heat dissipation surfaces in critical areas. The LED chips are positioned to maximize thermal contact with the heat sink, and the driver electronics are arranged to facilitate efficient heat management, ensuring adequate cooling performance within the compact structure.
Solution Approach 2:
The patent employs composite material structures in the heat sink design, combining materials with different thermal and mechanical properties to achieve optimal heat dissipation. The heat sink may incorporate materials with high thermal conductivity in contact areas with LED chips, while maintaining structural integrity and cost-effectiveness for mass production.
3Ease of manufacture
If LED chips are mounted on printed circuit board, then assembly is simplified, but emission characteristics become highly inhomogeneous
Solution Approach 1:
The patent addresses emission homogeneity by strategically positioning multiple LED chips on the printed circuit board substrate. The chips are arranged in a pattern that distributes light emission more uniformly across the light source. The substrate design includes features that help distribute and homogenize the light output, while maintaining the simplicity of printed circuit board mounting techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, cost-effective LED lamp with improved lighting quality, reduced flickering, and extended service life by optimizing the placement of driver electronics and using advanced materials for heat dissipation and volatile compound management.
Implementation Method 1
the glass bulb has an indentation which protrudes into the interior of the glass bulb and is in thermal contact with the printed circuit board
Implementation Method 2
incorporating a smoothing capacitor to reduce flickering and improve emission characteristics, along with a thermally conductive gas and getter material to enhance heat dissipation
Data Source
Figure 1A~1C
Figure 2A~2C
Figure 3A~3B
AI summary
An LED light source (1) is specified, comprising a glass bulb (20), a light module (100) with at least one light-emitting diode chip (11) which is mounted on a circuit board (12) by means of bare chip mounting, and driver electronics of the light module (100), wherein the light module (100) and the driver electronics are contained in the glass bulb (20).