LED Lamp with Transparent Polyurethane Heatsink
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Solution Overview
Problem
Existing LED lamps face challenges in efficiently dissipating heat, particularly for high-power lamps, due to the low thermal conductivity of materials used, which limits their luminous power and complicates design, and existing solutions often require complex heat removal systems that increase size and manufacturing complexity.
Innovation Solution
A radiator housing with a hollow transparent cylinder and flexible printed circuit board, where LEDs are mounted on the outer side of a rolled PCB, and a transparent polyurethane material forms the lamp body, diffuser, and cooling radiator, enhancing heat dissipation through improved thermal conductivity and convection cooling, allowing for higher power ratings up to 100 W or more.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal radiator is used for heat dissipation, then heat removal efficiency is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the radiator function with the lamp housing by making the housing itself from thermally conductive material (aluminum or copper), eliminating the need for separate radiator components. The housing serves dual purposes: structural enclosure and heat dissipation surface, thereby reducing device complexity while maintaining effective heat removal.
Solution Approach 2:
The lamp housing is designed to perform multiple functions simultaneously: it provides mechanical protection, serves as a heat sink for LEDs, and acts as a structural support element. This multi-functionality eliminates the need for dedicated separate components, simplifying the overall design while improving thermal management.
2Reliability
If the bulb cavity is filled with air for insulation, then electrical insulation is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent applies different material properties to different regions: the housing material provides both electrical insulation and thermal conduction pathways. By carefully selecting materials and designing heat dissipation surfaces, the structure achieves local thermal management without compromising overall electrical insulation, allowing heat to be conducted away from LEDs while maintaining safe operating voltages.
3Illumination intensity
If high-power LEDs are used to increase luminous output, then illumination intensity is improved, but heat generation increases causing overheating
Solution Approach 1:
The patent converts the harmful heat generated by high-power LEDs into a beneficial feature by designing the housing as an active heat dissipation structure. The thermally conductive housing material and optimized surface areas transform the waste heat into a manageable thermal flow, allowing high-power operation without overheating by utilizing the heat rather than trying to eliminate it.
4Illumination intensity
If a transparent diffuser is used for light emission, then light transmission is improved, but heat dissipation is blocked
Solution Approach 1:
The patent segments the housing into distinct functional zones: a transparent diffuser section for light emission and a thermally conductive housing section for heat dissipation. The housing structure includes dedicated heat dissipation surfaces and pathways that are separate from the light transmission path, allowing both functions to operate simultaneously without interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies manufacturing, improves heat dissipation, and allows for higher power LED lamps with reduced size and complexity, while maintaining resistance to external influences and minimizing costs, achieving efficient luminous flux with a luminous efficacy of approximately 147 lm/W.
Implementation Method 1
a transparent layer with a thickness of 0.2...0.5 mm, which is determined by the inner diameter of the tooling, and its centering in this case is guaranteed by stops
Implementation Method 2
enhancing heat dissipation through improved thermal conductivity and convection cooling
Data Source
AI summary
The solution relates to lighting technology, namely to LED lamps powered directly from the AC mains. The technical result is to simplify the design, improve heat dissipation and reduce the labor intensity of manufacturing high-power lamps of general use, resistant to external influences>IP65, and with a minimum cost and labor intensity. In some cases, the LED lamp contains a radiator housing made in the form of a hollow cylindrical body made of an optically transparent material; a flexible aluminum printed circuit board, on a mounting surface of which LEDs and a driver are mounted; end caps, at least one of which is provided with means for connecting to a power supply network, while the flexible printed circuit board is configured in the form of a roll, the mounting surface is disposed outward, and part of the board with the driver is bent inside the roll, while the light-emitting surface of the LEDs is immersed in a transparent material housing, and the mounting surface of the configured printed circuit board has direct thermal contact with the transparent material.