LED Lamp Thermal Management via Segmented PCB Design
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Solution Overview
Problem
LED luminaires and lamps face overheating issues due to increased heat production from LED modules and control integrated circuits, which can reduce the service life and light output, especially in applications with limited air circulation.
Innovation Solution
The solution involves separating the LED module's heat sink from the control and power circuitry by using a second printed circuit board thermally insulated from both the heat sink and the LED module, allowing for efficient heat dissipation and extended lifespan, particularly in enclosed or fire-rated luminaires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If LED modules and control components are mounted on the same printed circuit board in close thermal contact with a heat sink, then heat dissipation is improved, but the service life is reduced due to overheating of control components
Solution Approach 1:
The patent divides the circuit board into two separate printed circuit boards: a first PCB for mounting LED modules in thermal contact with the heat sink, and a second PCB for mounting control components that is thermally insulated from the heat sink. This segmentation allows each board to have optimized thermal characteristics, resolving the contradiction between heat dissipation and component protection.
Solution Approach 2:
The control components are extracted from the LED module assembly and mounted on a separate second printed circuit board that is thermally insulated from the heat sink. This extraction protects the control components from excessive heat while maintaining efficient heat dissipation for the LED modules.
2Extent of automation
If additional control integrated circuits with increased functionality are added, then automation and control capabilities are improved, but heat production increases requiring larger heat sinks
Solution Approach 1:
The patent segments the system into a thermally managed LED module section and a thermally insulated control section. This allows advanced control functionality to be added to the second PCB without compromising the thermal management of the LED modules, as the control components are thermally isolated from the heat sink.
3Illumination intensity
If LED modules are mounted in close thermal contact with a heat sink, then light output is improved, but control components overheat leading to premature failure
Solution Approach 1:
The patent uses two separate printed circuit boards to segment the thermal pathways: the first PCB allows maximum thermal contact between LED modules and heat sink for optimal light output, while the second PCB provides thermal insulation for control components, preventing their overheating and premature failure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the light output and extends the lifespan of LED lighting modules to 25,000 hours or more at L70 (70% lumen maintenance), even in conditions with reduced air circulation, by effectively managing heat generated by the LED and control components.
Implementation Method 1
the first printed circuit board (PCB) being in good thermal contact with the heat sink such that heat from the LED(s) is dissipated through the heat sink
Implementation Method 2
the second printed circuit board is thermally insulated from both the heat sink and from the first printed circuit board and thus from the LED module
Data Source
AI summary
Lighting modules and systems including a heat sink are generally disclosed. The exemplary embodiments include a lighting module having a light emitting diode (LED) board including at least one LED, a heat sink in thermal communication with the LED board for dissipating heat generated by at least the LED board, and a separate component board that is thermally insulated from the LED board and may include, for example, an LED driver, a power management component, a power conversion component, an LED control component, and a dimming component. At least one of the LED board and component board may be a printed circuit board (PCB).