LED Lamp Thermal Management via Segmented PCB Heat Dissipation
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Solution Overview
Problem
Existing LED lamps suffer from suboptimal heat transfer, limiting their performance, efficiency, and lifetime due to inefficient thermal management.
Innovation Solution
The LED lamp employs separate printed circuit boards for the LED and rectifier, with heat conducting cores and a heat dissipating element to effectively dissipate heat, using metal or ceramic cores and elements to improve thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat is dissipated through natural convection and thermal radiation from the heat sink, then the LED lamp can operate, but the heat transfer is far from optimal and prevents utilising the full performance, efficiency and lifetime of the LED lamp
Solution Approach 1:
The patent divides the thermal management system into multiple independent heat dissipation paths: a first heat dissipation path through the printed circuit board to the heat sink, and a second heat dissipation path through the heat dissipation component (thermal paste, thermal pad, or heat pipe) to the heat sink. This segmentation allows heat to be dissipated through multiple parallel channels, significantly improving overall heat transfer efficiency and preventing the LED from overheating, thereby extending its lifetime.
Solution Approach 2:
The patent combines multiple heat dissipation mechanisms into a unified thermal management system. The printed circuit board provides both electrical connection and thermal conduction pathways, while additional heat dissipation components (thermal paste, thermal pad, or heat pipe) are integrated to enhance thermal coupling between the LED and heat sink. This merging of functions creates a more efficient composite thermal management system that maximizes heat dissipation performance.
2Power
If the LED is operated at high power, then light output is improved, but a high amount of electrical power is converted to heat rather than light, requiring effective thermal management
Solution Approach 1:
The patent introduces intermediary thermal management components between the LED and heat sink, including thermal paste, thermal pad, or heat pipe. These intermediaries improve the thermal coupling efficiency by filling air gaps and providing low thermal resistance pathways. This allows high-power LEDs to operate at elevated light output levels while maintaining acceptable junction temperatures through enhanced heat transfer to the heat sink.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation, reducing maximum temperature and extending the LED lamp's performance and lifespan by effectively transferring heat away from the LED and rectifier components.
Implementation Method 1
The heat conducting core (layer) of the first printed circuit board functions as a heat spreader and thus improves thermal management. The heat conducting core of the first printed circuit board effectively draws heat from the LED.
Implementation Method 2
a heat dissipating element connected between the second printed circuit board and a second side of the first printed circuit board for dissipating heat
Implementation Method 3
From the heat sink, the heat is transferred to the ambient environment through natural convection and thermal radiation.
Implementation Method 4
The second printed circuit board also has a heat conducting core that functions as a heat spreader. The heat conducting core of the second printed circuit board effectively draws heat from the rectifier.
Data Source
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AI summary
The present invention relates to an LED lamp that comprises a first printed circuit board (102) having a heat conducting core (103), an LED (101) mounted on a first side of the first printed circuit board (102), a second printed circuit board (106), a rectifier (105) mounted on the second printed circuit board (106), and a heat dissipating element (112) connected between the second printed circuit board (106) and a second side of the first printed circuit board (102) for dissipating heat.