LED Lamp Sleeve Layout for Power Source Thermal Isolation

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Solution Overview

Problem

Current LED lamps lack effective heat management between the heat sink and power source, leading to mutual thermal influence that can affect the lifespan of electronic components and the lamp as a whole, especially in high-power applications.

Innovation Solution

The LED lamp design incorporates a sleeve made of material with lower thermal conductivity than the heat sink, thermally insulating the power source from the heat sink, along with a passive heat dissipating system using fins and air channels for efficient heat dissipation, ensuring that heat from the power source and LED chips is effectively managed without direct thermal conduction to the power source.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the power source is disposed close to the heat sink for compact structure, then the device complexity is reduced, but the heat from the heat sink adversely affects the power source components

Engineering Contradiction:

Improvestructural complexityVSAvoidthermal effect on power source

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a sleeve made of thermally insulating material positioned between the heat sink and the power source. This sleeve acts as a thermal intermediary that blocks heat conduction from the heat sink to the power source components, thereby protecting sensitive electronics while maintaining the compact integrated structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies different material properties to different regions: the sleeve is specifically designed with low thermal conductivity material to provide thermal insulation where needed, while other parts of the lamp shell may use materials with different properties for their respective functions, optimizing both thermal management and structural integrity.

Inventive Principle:

Principle #3Local quality

2Illumination intensity

If high-power LED chips are used to increase luminous output, then the illumination intensity is improved, but the heat dissipation requirement increases and affects component lifespan

Engineering Contradiction:

Improveluminous outputVSAvoidheat dissipation

Core Design Contradiction:

Illumination intensityVSTemperature

Solution Approach 1:

The patent extracts the power source from the high-temperature zone near the LED heat sink and places it in a thermally isolated environment using the insulating sleeve. This separation removes the heat-sensitive components from the adverse thermal environment created by high-power LED operation, enabling higher luminous output without compromising component lifespan.

Inventive Principle:

Principle #2Taking out (Extraction)

3Productivity

If the lamp shell material has high thermal conductivity for heat dissipation, then the heat dissipation efficiency is improved, but the power source components are adversely affected by heat conduction

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidcomponent lifespan

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent segments the thermal management system into distinct zones: the lamp shell can use thermally conductive materials for overall heat dissipation from LED chips, while the sleeve surrounding the power source uses thermally insulating material to create a protected zone. This segmentation allows simultaneous optimization of heat dissipation efficiency and component reliability.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the heat dissipation efficiency of both the power source and LED chips, reducing the risk of overheating and prolonging the lifespan of electronic components while maintaining effective heat management within the weight and structural constraints of the lamp.

Implementation Method 1

the sleeve of the lamp shell is made of a material having lower thermal conductivity than that of material of the heat sink; wherein the sleeve of the lamp shell is encircle covered by the heat sink, such that the second portion of the power source and the heat sink of the passive heat dissipating element are thermally insulated by the sleeve

Methodology Applied

Scientific EffectThermal Insulation: Thermal Insulation

Implementation Method 2

a passive heat dissipating element having a heat sink connected to the lamp shell

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Implementation Method 3

the light emitting surface is connected to the heat sink of the passive heat dissipating element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10627095B2LED lamp with a sleeve

Publication Date: 2020.04.21 JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO LTD

AI summary

An LED lamp includes: a lamp shell including a lamp head, a lamp neck and a sleeve; a passive heat dissipating element having a heat sink; a power source having a first portion and a second portion; and a light emitting surface comprising LED chips; wherein the sleeve of the lamp shell is made of a material having lower thermal conductivity than that of material of the heat sink; wherein the sleeve of the lamp shell is encircle covered by the heat sink, such that the second portion of the power source and the heat sink of the passive heat dissipating element are thermally insulated by the sleeve to prevent thermal effecting from the heat sink to the power source in the sleeve.