LED Lamp Substrate Inclined Planes Heat Sink

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Solution Overview

Problem

Current LED lamps face challenges with heat-dissipation efficiency, narrow illumination beam angles, and non-uniform illumination intensity, limiting their lifespan and effectiveness in providing wide and even lighting.

Innovation Solution

The LED lamp design features a substrate with inclined planes for distributing LED lighting elements, a heat sink with fin-shaped radiation structures, and a reflector to enhance heat dissipation and light distribution, resulting in improved heat dissipation efficiency and uniform illumination intensity across a wider beam angle.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If LEDs are arranged in an array on a plane, then the lamp structure is simple and easy to manufacture, but the beam angle becomes narrow and illumination is non-uniform

Engineering Contradiction:
ImproveLED arrangement simplicityVSAvoidbeam angle and uniformity
Core Design Contradiction:
Ease of manufactureVSIllumination intensity

Solution Approach 1:

The patent transitions from a two-dimensional planar arrangement of LEDs to a three-dimensional configuration where LEDs are positioned at different heights and angles relative to the base plate. This dimensional change allows light to be emitted in multiple directions simultaneously, expanding the beam angle from a narrow directional pattern to a wide omnidirectional pattern while maintaining manufacturing simplicity through modular LED module design.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Illumination intensity

If high-powered LEDs are used to increase brightness, then illumination intensity improves, but heat dissipation becomes insufficient and lifespan is limited

Engineering Contradiction:
ImprovebrightnessVSAvoidlifespan due to overheating
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The patent divides the heat dissipation function into multiple independent components: individual heat sinks for each LED module, fin-shaped radiation structures on the base plate, and ventilation channels. This segmentation allows each component to handle heat from specific LED sources efficiently, preventing heat accumulation and ensuring that high-powered LEDs can operate at full brightness without compromising reliability due to overheating.

Inventive Principle:
Principle #1Segmentation

3Temperature

If a radiator is installed on the back of the base plane to improve heat dissipation, then heat dissipation efficiency increases, but the packaging structure interferes with effective heat dissipation

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidpackaging structure interference
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the heat dissipation function directly into the base plate structure itself, combining the structural support function with thermal management. The base plate incorporates fin-shaped radiation structures and ventilation channels as integral features rather than separate components. This eliminates the need for additional packaging modifications and allows heat dissipation to occur efficiently through the base plate's own structure, resolving the conflict between heat dissipation efficiency and packaging complexity.

Inventive Principle:
Principle #5Merging (Combining)

4Ease of manufacture

If LEDs are distributed on the same plane for simple structure, then manufacturing is easy, but heat dissipation efficiency is insufficient

Engineering Contradiction:
ImproveLED distribution simplicityVSAvoidheat dissipation efficiency
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent moves LED modules from a single-plane two-dimensional distribution to a multi-level three-dimensional arrangement. LED modules are positioned at different heights above the base plate, with some mounted on vertical surfaces and others on horizontal surfaces. This spatial distribution increases the surface area available for heat dissipation while maintaining manufacturing simplicity through standardized LED module components that can be installed in various orientations.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly enhances heat dissipation and achieves uniform illumination intensity with a wider beam angle, extending the lamp's lifespan and improving lighting performance.

Implementation Method 1

a heat sink connected with the substrate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heat sink with fin-shaped radiation structures

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

a reflector to enhance heat dissipation and light distribution

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS7936119B2Wide-angle LED lighting lamp with high heat-dissipation efficiency and uniform illumination
Publication Date: 2011.05.03 CHENG YUNG PUN
  • US7936119B2 patent drawing
  • US7936119B2 patent drawing
  • US7936119B2 patent drawing

AI summary

LED lighting lamps provide optimum heat dissipation efficiency, wide illumination beam angles, and substantially uniform illumination intensity. Generally, the disclosed LED lamps comprise at least one LED lighting element and a substrate with a plurality of inclined planes.