LED Lamp Assembly Thermal Management via Conductive Fill
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Solution Overview
Problem
Current LED lighting technologies face challenges with thermal management and reliability, particularly in residential applications, where high ambient temperatures can affect the performance and longevity of LED lamps, and they lack the warm white color and dimmability of incandescent lamps.
Innovation Solution
An LED lamp assembly with an integrated electronic ballast and thermal management system, where a thermally conductive substance is used to draw heat away from the LED through a circuit board and into a metallic Edison-style screwbase, maintaining component temperatures below 50°C and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LED technology is used to improve energy efficiency and lifespan, then energy consumption is reduced and lifetime is extended, but thermal management becomes problematic and reliability decreases in high temperature environments
Solution Approach 1:
The patent introduces a thermally conductive substance as an intermediary material between the LED and the heat sink. This substance fills the interface gap and improves thermal contact, allowing efficient heat transfer from the LED to the heat sink, thereby managing thermal issues and improving reliability in high-temperature environments
Solution Approach 2:
The patent extracts and separately addresses the thermal management function by incorporating a dedicated heat sink structure and thermally conductive materials. This separates the lighting function from the heat dissipation function, allowing each to be optimized independently while working together in the integrated LED lamp assembly
2Ease of operation
If electronic ballast is integrated into LED lamp to provide controlled power supply, then power regulation is improved, but device complexity increases
Solution Approach 1:
The patent merges the electronic ballast circuitry directly into the LED lamp assembly, integrating the power regulation function with the LED driver. This consolidation eliminates the need for separate external ballasts, simplifies installation, and provides controlled power supply while maintaining manageable device complexity through integrated design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated thermal management system effectively cools the LED and ballast, ensuring long lifespan and reliability, while the integrated ballast provides a reliable power supply, making the LED lamp assembly suitable for residential use with improved efficiency and dimmability.
Implementation Method 1
a thermally conductive substance is used to draw heat away from the LED through a circuit board and into a metallic Edison-style screwbase, maintaining component temperatures below 50°C
Data Source
AI summary
An light emitting diode lamp assembly in accordance with an embodiment of the present application includes a base, a ballast circuit mounted on a circuit board and operable to provide a desired output current and a light emitting diode electrically connected to the ballast and driven by the output current of the ballast circuit to provide light. The base is filled with a thermally conductive substance and the circuit board is mounted in the base and in thermal contact with the thermally conductive substance such that heat is drawn away from the light emitting diode through the circuit board and into the thermally conductive substance to the base.