LED Lamp Circuit Board Through-Hole Lead Wire Routing
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Solution Overview
Problem
The existing LED lamp design requires spaces between the circuit board and housing to route lead wires, limiting miniaturization and increasing manufacturing costs due to the need for manual, multi-step soldering.
Innovation Solution
A lamp design with a circuit board featuring a through-hole allowing lead wires to pass directly from one surface to the other, eliminating the need for these spaces and enabling flow soldering, which reduces manufacturing costs and improves reliability by increasing the bend radius of the lead wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If lead wires are routed from the opposite surface of the circuit board through openings in the housing, then electrical connection between LED module and drive unit is achieved, but the housing cannot be reduced in size, interfering with miniaturization
Solution Approach 1:
The patent changes the routing dimension of lead wires from external housing space to internal circuit board through-holes. Instead of routing wires through openings in the housing (external dimension), the wires pass through through-holes formed in the circuit board itself (internal dimension), thereby eliminating the need for additional housing space and achieving miniaturization.
Solution Approach 2:
The lead wires are nested within the circuit board structure by passing through through-holes formed in the circuit board. This nesting approach allows the wires to be contained within the existing circuit board volume rather than requiring separate housing openings, thus reducing overall housing size while maintaining electrical connectivity.
2Volume of moving object
If lead wires are directly drawn from the opposite surface of the circuit board to eliminate spaces, then housing size can be reduced, but manual multi-step soldering is required, increasing manufacturing cost and reducing productivity
Solution Approach 1:
The patent performs preliminary action by forming through-holes in the circuit board before mounting electronic components. This preliminary structure preparation allows lead wires to be directly routed and soldered in a single flow soldering process without requiring manual multi-step operations, thereby maintaining high productivity while achieving compact housing design.
Solution Approach 2:
The patent merges the lead wire routing and soldering operations into a single flow soldering process. Instead of separate manual soldering steps, the through-hole structure enables all lead wires to be soldered simultaneously in one process, improving productivity while maintaining the space-efficient design.
3Reliability
If through-holes are formed in the circuit board for lead wire passage, then lead wire bend radius is increased improving reliability, but additional manufacturing steps are required
Solution Approach 1:
The patent changes the geometric parameter of lead wire routing by introducing through-holes in the circuit board. This parameter change allows lead wires to follow a longer, gentler path (increased bend radius) rather than sharp external bends, thereby improving reliability. The through-hole structure is formed as a standard circuit board feature, integrating the reliability improvement without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design miniaturizes the lamp, reduces manufacturing costs, and enhances reliability by preventing lead wire breakage through increased bend radius and efficient soldering processes.
Implementation Method 1
The lead wires 170a, 170b, 171a, and 171b are connected to the circuit board 180a... The LED module 120 and the drive unit 180 are electrically connected to each other via the lead wires 170a and 170b
Implementation Method 2
soldering is performed with respect to a surface opposite the main surface... the lead wires 170a and 170b are soldered onto the circuit board 180a
Data Source
AI summary
A lamp includes an LED module, a drive unit supplying power to the LED module, and a base via which power is fed from an external power supply to the drive unit. The drive unit is located between the LED module and the base. The drive unit includes a circuit board having a main surface on which lead-type electronic components are mounted, lead wires (first lead wires) extending from the main surface of the circuit board and connected to the LED module, and lead wires (second lead wires) extending from the main surface of the circuit board and connected to the base. The circuit board has a through-hole extending from the main surface to an opposite surface thereof. The lead wires pass through the through-hole.