LED Lamp Upper Heat Dissipating Structure for Thermal-Optical Balance

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Solution Overview

Problem

Existing LED lighting devices face challenges in achieving a balance between effective heat dissipation and optimal light intensity distribution, with conventional heat dissipating structures often obstructing light emission and interfering with optical performance.

Innovation Solution

A lighting device with a specially designed upper heat dissipating structure that minimizes light obstruction by positioning heat dissipation elements perpendicularly to the LED arrangement, allowing for efficient heat dissipation while maintaining unobstructed light emission into desired directions, and incorporating a lower heat dissipating structure for additional cooling and mechanical protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional heat dissipating structures are used, then heat dissipation function is achieved, but light emission is obstructed and optical performance deteriorates

Engineering Contradiction:
Improveheat dissipationVSAvoidlight emission
Core Design Contradiction:
TemperatureVSIllumination intensity

Solution Approach 1:

The heat dissipating structure is divided into multiple heat dissipating elements (first, second, third, and fourth elements) arranged in a specific pattern around the LED element. This segmentation allows light to pass through gaps between elements while still providing effective heat dissipation surface area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat dissipating elements are positioned asymmetrically at different radial distances from the longitudinal axis, with first and second elements closer and third and fourth elements farther away. This asymmetric arrangement optimizes both light transmission paths and heat dissipation efficiency.

Inventive Principle:
Principle #4Asymmetry

2Temperature

If heat dissipating structure is positioned close to LED element, then heat dissipation efficiency is improved, but obstruction of light into desired emission directions increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidoptical performance
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The heat dissipating elements extend in the longitudinal direction (parallel to the optical axis) rather than only radially outward. This dimensional arrangement allows the elements to be positioned close to the LED for effective heat dissipation while their elongated shape minimizes the solid angle they block for light emission.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Different regions of the heat dissipating structure serve different functions: elements closer to the LED provide primary heat dissipation, while the spatial arrangement of all elements collectively minimizes light obstruction. The structure optimizes local heat dissipation while maintaining global optical performance.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables effective heat dissipation and maintains high light intensity distribution, meeting both thermal and optical design requirements, while also providing mechanical protection for the LED elements.

Implementation Method 1

a first heat dissipating element and a second heat dissipating element of the upper heat dissipating structure, each having a respective outer end, spaced from each other in a direction parallel to the traverse axis

Methodology Applied
Scientific EffectHeat dissipation: Conduction (thermal)

Implementation Method 2

The upper heat dissipating structure comprises one or more heat dissipation elements made out of a heat conducting material, preferably planar heat dissipation elements such as heat fins

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

an LED arrangement with at least one LED element

Methodology Applied
Scientific EffectLight emitting diode effect: Light Emitting Diode

Implementation Method 4

LED (light emitting diode) elements are increasingly used due to their advantageous properties of high efficiency and long lifetime

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 5

incorporating a lower heat dissipating structure for additional cooling and mechanical protection

Methodology Applied
Scientific EffectHeat dissipation: Conduction (thermal)

Data Source

PatentEP2702314B1LED lighting device with upper heat dissipating structure
Publication Date: 2017.08.16 KONINKLIJKE PHILIPS NV
  • EP2702314B1 patent drawingFigure 1~4
  • EP2702314B1 patent drawingFigure 5~8
  • EP2702314B1 patent drawingFigure 9~12

AI summary

A lighting device, or LED lamp 10 is described with a base element 12 for electrical contacting and mechanical mounting and an LED arrangement 20 with at least one LED element 70. The LED arrangement 20 is spaced from the base element 12 along a longitudinal axis L. In order to provide a lighting device and a lighting arrangement with a matched optical and thermal design, i. e. where both effective heat dissipation and an advantageous light intensity distribution are achieved,an upper heat dissipating structure 60 is arranged next to the LED arrangement 20 with at least one heat dissipation element 62 made out of a heat conducting material. The upper heat dissipating structure 60 is shaped to include at least a first end 64a and a second end 64b spaced from the first end 64a along a traverse axis T. The traverse axis T is substantially perpendicular to the longitudinal axis L. The LED arrangement 20 is arranged between the first and second ends 64a, 64b.