LED Lamp Source With White Reflective Layer For Color Uniformity
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Solution Overview
Problem
Four side emission LEDs have poor uniformity of optical colors, leading to a low light adoption rate and increased costs for backlight modules due to inefficiencies in light distribution.
Innovation Solution
A light emitting diode (LED) lamp source is enhanced with a substrate, LED chip, fluorescent adhesive, and a white reflective layer, where the adhesive encapsulates the chip and the reflective layer is configured to reflect light emitted from the adhesive, increasing optical reflection dimensions and uniformity, and a manufacturing method involving crystal expansion and cutting processes to form independent LED units with a white reflective layer that enhances light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If four side emission LED is used with fluorescent adhesive and white reflective layer, then small dimension and high driving power are achieved, but uniformity of optical colors deteriorates
Solution Approach 1:
The patent applies local quality by creating different structural zones within the LED lamp source. The LED chips are arranged in a matrix with specific spacing, and the fluorescent adhesive is applied selectively to encapsulate individual chips while maintaining gaps between them. This localized structural differentiation allows each region to contribute to uniform light emission while preserving the high driving power of multiple LEDs.
Solution Approach 2:
The patent segments the LED lamp source into multiple independent LED chips arranged in a matrix pattern. By dividing the light-emitting structure into discrete, spaced-apart chips rather than a continuous structure, the design achieves both high driving power through multiple sources and improved optical uniformity through distributed emission points that reduce hot spots and color variations.
2Volume of moving object
If four side emission LED is used with fluorescent adhesive and white reflective layer, then small dimension is achieved, but light adoption rate deteriorates
Solution Approach 1:
The patent transitions from conventional planar LED arrangements to a three-dimensional matrix configuration of LED chips with vertical stacking and horizontal spacing. This dimensional change allows light to be emitted from multiple levels and angles, increasing the effective light adoption rate while maintaining a compact overall footprint. The gaps between chips in the matrix arrangement create additional light extraction pathways.
Solution Approach 2:
The patent applies preliminary action by pre-configuring the LED chips in a matrix pattern with predetermined gaps before applying the fluorescent adhesive. The crystal expansion and crystal solid processes are performed in advance to establish the precise spacing and positioning of chips, ensuring optimal light distribution and adoption rate before the final encapsulation step.
3Power
If four side emission LED is used, then high driving power is achieved, but In-Bin rate deteriorates
Solution Approach 1:
The patent employs parameter changes by systematically varying the spacing between LED chips in the matrix arrangement and adjusting the thickness and composition of the fluorescent adhesive layer. These parameter optimizations ensure that light from multiple high-power chips combines uniformly, expanding the acceptable color tolerance range (In-Bin rate) while maintaining high driving power. The crystal expansion and solid processes also control the physical parameters of the adhesive to achieve optimal light mixing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the uniformity of optical colors and increases the in-bin rate of LEDs, reducing the number of required LED lamp sources and subsequently lowering the cost of backlight modules.
Implementation Method 1
a white reflective layer formed on the fluorescent adhesive, the fluorescent adhesive encapsulating the LED chip on the substrate, the white reflective layer being configured for reflecting light beams emitted from the fluorescent adhesive
Implementation Method 2
fluorescent adhesive encapsulating the LED chip on the substrate, the white reflective layer being configured for reflecting light beams emitted from the fluorescent adhesive
Data Source
AI summary
The present disclosure relates to a LED lamp source and the manufacturing method and the backlight module thereof. The LED lamp source includes a substrate and a LED chip, fluorescent adhesive, and a white reflective layer being fixed on the substrate. The fluorescent adhesive encapsulates the LED chip on the substrate, and the white reflective layer is configured for reflecting light beams emitted from the fluorescent adhesive and being radiated on the white reflective layer. A positive projection of the fluorescent adhesive on the substrate is within the positive projection of the white reflective layer on the substrate.