Light Emitting Device Lead Electrode Recesses for Mounting Accuracy
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Light emitting devices with side-view configurations face issues due to variance in machining accuracy, particularly in the bending position and angle of lead electrodes, which affects the mounting accuracy and reliability of the device.
Innovation Solution
The design incorporates a resin molding with specific recessed sections on the lead electrodes, allowing for precise bending and stabilization, reducing variance in the bending position and angle, and enhancing adhesion between the leads and the resin molding, thereby improving mounting precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If lead electrodes are bent at a specific angle to achieve compact device structure, then device size is reduced, but machining accuracy variance increases causing poor mounting accuracy
Solution Approach 1:
The patent forms recessed sections on the lead electrodes before the bending process. These recesses are pre-positioned features that will later serve as precise bending locations, eliminating variability in bending position and improving mounting accuracy while maintaining the compact device structure
Solution Approach 2:
The patent introduces recessed sections at specific locations on the lead electrodes to create localized features with different properties than the rest of the lead structure. These recesses provide controlled bending zones that ensure consistent bending behavior and improve manufacturing precision without affecting the overall device compactness
2Device complexity
If lead electrodes are bent to achieve side-view configuration, then device structure is compact, but bending position and angle variance diminishes mounting accuracy
Solution Approach 1:
The recessed sections are formed on the lead electrodes before bending, establishing predetermined bending locations and angles. This preliminary structuring ensures that subsequent bending operations produce consistent results, maintaining both the compact side-view configuration and high mounting accuracy
Solution Approach 2:
The patent modifies the physical parameters of the lead electrodes by creating recessed sections with specific dimensions and locations. These parameter changes create controlled zones that guide the bending process, ensuring consistent bending position and angle while maintaining the compact device structure
3Ease of manufacture
If standard lead electrode bending is used, then manufacturing process is simple, but adhesion between leads and resin molding is insufficient
Solution Approach 1:
The recessed sections create localized areas on the lead electrodes with increased surface area and improved mechanical interlocking capability. These local modifications enhance adhesion between the leads and resin molding at critical bonding locations without complicating the overall manufacturing process
Solution Approach 2:
The recessed sections are formed in advance before the resin molding process, preparing the lead surfaces for optimal adhesion. This preliminary surface preparation ensures strong bonding between leads and resin while maintaining a straightforward manufacturing workflow
Data Source
AI summary
A light emitting device includes a resin molding, first and second leads, and a light emitting element. The resin molding includes a front surface defining an opening, and a lower surface adjacent to the front surface. The first and second leads each includes an outer lead portion and an inner lead portion. The outer lead portion protrudes from the lower surface of the resin molding, and includes a bent portion bent along the lower surface. A surface on an inner side of the bent portion including a first recessed section. The inner lead portion includes an embedded portion embedded in the resin molding, and an exposed portion exposed in the opening. A surface of the embedded portion opposite from the surface where the first recessed section is provided includes a second recessed with a part of the resin molding being positioned in the second recessed section.