LED Lead Frame Concave-Convex Attachment
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Solution Overview
Problem
Conventional light emitting diode (LED) devices face issues with the process of bending conductive supports to secure them to an insulating housing, leading to increased device height and difficulty in preventing removal of the lead frame unit.
Innovation Solution
A lead frame unit with concave-convex structures on its conductive bodies increases the contact area with the insulating housing, providing a firm attachment and preventing removal, while eliminating the need for bending and reducing the overall device height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive supports are bent to form hook ends against the bottom part of the insulating housing, then the conductive supports are secured to the insulating housing, but the total height of the LED device is significantly increased and the process is troublesome
Solution Approach 1:
The patent transitions from a vertical bending approach (forming hook ends that extend downward) to a horizontal protrusion approach (extending outward from the side edges). This dimensional change allows the conductive bodies to achieve secure attachment without increasing the vertical height of the device, as the protrusions extend in the transverse direction rather than the axial direction
Solution Approach 2:
The concave-convex structures are pre-formed on the conductive bodies before assembly with the insulating housing. The protrusions are already positioned and shaped to engage with corresponding recesses in the housing, eliminating the need for post-assembly bending operations and ensuring proper attachment geometry from the start
2Reliability
If conductive supports are bent to form hook ends, then the conductive supports are secured to the insulating housing, but the process is troublesome
Solution Approach 1:
The concave-convex structures are pre-formed on the conductive bodies during the lead frame manufacturing process, before assembly with the insulating housing. This preliminary formation of attachment structures eliminates the need for subsequent bending operations, simplifying the manufacturing process and reducing operational complexity
Solution Approach 2:
The patent extracts the attachment function from the bending process and incorporates it directly into the lead frame structure through pre-formed protrusions. This separates the attachment structure formation from the assembly process, allowing each to be optimized independently and reducing overall process complexity
Data Source
AI summary
A package structure is adapted for mounting at least one light emitting diode (LED) die. The package structure includes an insulating housing, and a lead frame unit including two spaced-apart conductive bodies. Each of the conductive bodies has opposite first and second conductive terminals spaced-apart from each other along an axial direction. The first conductive terminals extend into the insulating housing. The second conductive terminals are exposed outwardly of the insulating housing. Each of the conductive bodies further has two side edges spaced-apart from each other along a transverse direction perpendicular to the axial direction, and a concave-convex structure disposed at the side edges and surrounded by the insulating housing.