Multi-Layer LED Lead Frame for Thin-Package Heat Dissipation
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Solution Overview
Problem
Conventional side type light emitting diodes face challenges in heat dissipation as they become thinner, leading to increased temperature rise due to reduced space between the diode chip and the reflector.
Innovation Solution
A light emitting diode with a lead frame unit comprising multiple conductive layers on different layers, including an upper, intermediate, and lower conductive layers, and a dummy terminal structure for improved heat dissipation, connected through insulating substrates and solder paste to facilitate heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the side type light emitting diode package is reduced, then the display device thickness is reduced, but the heat dissipation performance deteriorates due to narrow space between the light emitting diode chip and the reflector
Solution Approach 1:
The patent transitions from a conventional single-layer lead frame structure to a multi-layer lead frame structure with upper, intermediate, and lower conductive layers arranged in different spatial dimensions. This dimensional change enables heat to be dissipated through multiple pathways and layers, effectively addressing the heat dissipation problem caused by reduced package thickness while maintaining the thin profile required for modern display devices.
2Volume of moving object
If the space between the light emitting diode chip and the reflector is reduced, then the package thickness is reduced, but the temperature rise increases requiring heat dissipation design
Solution Approach 1:
The patent segments the heat dissipation function across multiple independent conductive layers (upper, intermediate, and lower layers) within the lead frame structure. Each layer serves as a separate heat dissipation pathway, allowing heat to be distributed and dissipated through multiple segmented routes rather than relying on a single heat dissipation path, thereby reducing temperature rise in the compact package volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation performance by dispersing heat through multiple conductive layers and dummy terminals, ensuring effective heat radiation and improved thermal management.
Implementation Method 1
a first lead terminal structure and a second lead terminal structure, wherein the first lead terminal structure, the second lead terminal structure, or both include an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another
Implementation Method 2
connected through insulating substrates and solder paste to facilitate heat radiation
Data Source
AI summary
A light emitting diode having an improved heat dissipation effect includes a light source unit emitting a light to a front surface and including a light emitting part, a first electrode pad, and a second electrode pad. The light emitting diode further includes a lead frame unit disposed on a rear surface of the light source unit and including first and second lead terminals respectively connected to the first and second electrode pads. The light emitting diode also includes at least one of the first and second lead terminals includes an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another.