LED Package Lead Frame Vertical Heat Dissipation
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Solution Overview
Problem
The challenge is to enhance the reliability and heat dissipation of side-emission type light emitting diode packages as they become thinner, leading to narrower spaces between the light emitting diode chip and the reflector, which complicates heat management in thinner display devices.
Innovation Solution
A light emitting diode package design featuring a lead frame unit with a body portion, conductive layers, and a connection portion that includes solder holes and insulating layers, along with a light source unit having wavelength converters, to ensure stable electrical and thermal connections while maintaining a slim profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the side-emission type light emitting diode package is decreased, then the display device becomes thinner, but the space between the light emitting diode chip and the reflector becomes narrower, making heat dissipation more difficult
Solution Approach 1:
The patent introduces a through-hole penetrating the lead frame body from the first surface to the second surface, creating a vertical heat dissipation pathway. This dimensional approach allows heat to be conducted from the light emitting diode chip through the lead frame thickness, effectively adding a Z-axis heat dissipation route that works independently of the reduced horizontal spacing between chip and reflector.
Solution Approach 2:
The lead frame body acts as an intermediary heat conduction medium between the light emitting diode chip and the external environment. The through-hole filled with conductive material enhances this intermediary function by providing a dedicated thermal pathway, allowing the lead frame to efficiently transfer heat away from the chip even when the overall package thickness is reduced.
2Length of moving object
If the thickness of the side-emission type light emitting diode package is decreased, then the display device becomes thinner, but the design for heat dissipation becomes more complex
Solution Approach 1:
The patent merges the electrical connection function and heat dissipation function into a single integrated lead frame structure. The through-hole serves dual purposes: providing electrical connection pathways and creating heat dissipation channels. This consolidation eliminates the need for separate heat dissipation components, simplifying the overall design despite the reduced package thickness.
Solution Approach 2:
The lead frame is designed with multi-functionality, serving as both an electrical interconnection structure and a heat dissipation system. The through-hole configuration enables the lead frame to simultaneously perform electrical bonding and thermal management functions, reducing design complexity by eliminating the need for dedicated heat sinks or thermal vias in traditional configurations.
3Length of moving object
If the space between the light emitting diode chip and the reflector is narrowed, then the package thickness is reduced, but the reliability is compromised due to disconnection risks
Solution Approach 1:
The patent applies local quality enhancement by concentrating structural reinforcement at critical connection points. The protrusion structure extending from the first surface of the lead frame body provides localized mechanical support and bonding area enhancement at the light emitting diode chip mounting location, ensuring reliable electrical and mechanical connection despite the overall reduced package thickness.
4Length of moving object
If the package thickness is reduced, then the integration density increases, but the heat dissipation efficiency decreases
Solution Approach 1:
The through-hole creates a vertical heat dissipation dimension that is independent of the horizontal chip-to-reflector spacing. Heat can be conducted upward through the lead frame thickness via the through-hole, providing an additional thermal pathway that compensates for the reduced horizontal distance available for heat dissipation in thinner packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heat resistance and reliability by maintaining a thin thickness and high integration while preventing disconnection, ensuring efficient heat dissipation and reliable operation in thinner display devices.
Implementation Method 1
a connection portion disposed between the first conductive layer and the second conductive layer and penetrating through the body portion
Implementation Method 2
the body portion including at least one solder hole recessed from the second surface of the body portion
Data Source
AI summary
A light emitting diode including a lead frame unit and a light source unit disposed on the lead frame unit, in which the lead frame unit includes a body portion having a first surface contacting the light source unit and a second surface opposite to the first surface, at least one solder hole recessed from the second surface of the body portion, a first conductive layer disposed on the first surface of the body portion and including a circular portion having a substantially circular shape and an elongated portion provided integrally with the circular portion and elongating in one direction from the circular portion, a second conductive layer disposed on the second surface of the body portion, and a connection portion disposed between the first conductive layer and the second conductive layer and penetrating through the body portion.