LED Lead Frame with Gapless Metal Ring
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Solution Overview
Problem
Conventional LED packaging processes result in excess glue due to resin slits at metal gaps, leading to reduced light intensity and unreliable manufacturing processes.
Innovation Solution
A lead frame structure featuring a ceramic bed with a gapless metal ring surrounding the metal circuit areas, formed through electroplating or similar processes, which prevents excess glue by obstructing resin infiltration during the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gaps are used to divide electrodes in the metal circuit layer, then resin can be applied to prevent excess glue, but resin slits still form at the gaps causing excess glue to occur in the function area
Solution Approach 1:
The patent removes the gaps from the metal circuit layer entirely, extracting the source of the problem (gap-induced resin slits) while maintaining electrode division through the metal ring structure. This eliminates the interface where resin slits form, preventing excess glue without compromising light concentration.
Solution Approach 2:
Instead of using gaps to control resin flow, the patent inverts the approach by using a continuous metal ring structure to physically block resin infiltration. The metal ring acts as a barrier rather than a guide, preventing resin from entering the function area where it would create excess glue and slits.
2Reliability
If multiple processes are used to form metal circuit areas and distinguish electrodes, then electrode distinction is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The metal ring serves multiple functions simultaneously: it divides the first and second metal circuit areas, distinguishes between positive and negative electrodes, and prevents resin infiltration. This multi-functionality eliminates the need for separate structures or processes for each function, simplifying manufacturing while maintaining reliability.
Solution Approach 2:
The patent merges the electrode division function and the resin prevention function into a single integrated metal ring structure. Rather than using separate gaps for division and separate barriers for resin prevention, the continuous metal ring combines both functions, reducing manufacturing steps and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the intensity and reliability of LED packaging by eliminating resin slits, simplifying the manufacturing process, and reducing costs through direct electroplating of the metal layer.
Implementation Method 1
The metal layer is directly electroplated to form the first metal circuit area, the second metal circuit area and slitless or indentless metal ring
Data Source
AI summary
A lead frame structure of a light emitting diode includes a ceramic bed, a metal layer and a plastic seat. The metal layer has a first metal circuit area, a second metal circuit area, a gap dividing the first metal circuit area and the second metal circuit area, and a metal ring surrounding the first metal circuit area, the second metal circuit area and the gap. The plastic seat has a hollow function area. The first metal circuit area, the second metal circuit area and a part of the metal ring expose the function area to make the metal (circuit) layer of the function area has no gap to avoid excess glue. This can efficiently accomplish to increase intensity, quality and reliability of the packaged products.