Lead Frame Diffusion Roughness for Uniform LED Illumination
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Solution Overview
Problem
Existing light-emitting device packages have limited viewing angles and radiation widths due to smooth reflective surfaces, leading to non-uniform brightness and increased manufacturing costs from requiring a large number of packages to achieve uniform illumination.
Innovation Solution
A method for manufacturing a lead frame with a reflective plating layer having diffusion roughness, achieved through surface processing techniques such as etching, oxidation, and plating processes using materials like nickel, copper, and silver, forming a non-brilliant and high brilliant plating layer with spherical morphology to enhance light diffusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a smooth reflective surface is used on the lead frame, then light extraction efficiency is improved, but viewing angle and radiation width are limited
Solution Approach 1:
The patent changes the surface parameter of the reflective plating layer from smooth to having diffusion roughness. This parameter change enables the surface to simultaneously maintain high reflectivity for light extraction while creating multiple light scattering paths that expand the viewing angle and radiation width, resolving the contradiction between light extraction efficiency and angular coverage.
Solution Approach 2:
The patent introduces curved surface features through diffusion roughness on the reflective plating layer. These micro-curved surfaces scatter light in multiple directions, transforming the single-direction reflection of smooth surfaces into multi-directional light distribution, thereby expanding viewing angle and radiation width while preserving light extraction efficiency.
2Illumination intensity
If multiple light-emitting device packages are used to achieve uniform illumination, then brightness uniformity is improved, but manufacturing cost increases
Solution Approach 1:
By changing the surface parameter of the reflective plating layer to include diffusion roughness, a single light-emitting device package can achieve uniform illumination across a wide area. The roughness creates multiple light scattering paths that distribute light uniformly, eliminating the need to use multiple packages and thereby reducing manufacturing costs while maintaining brightness uniformity.
3Adaptability or versatility
If a reflective plating layer with diffusion roughness is formed, then viewing angle and radiation width are increased, but manufacturing process complexity increases
Solution Approach 1:
The patent applies preliminary surface treatment to the base substrate before forming the reflective plating layer. By pre-creating diffusion roughness on the substrate surface, the subsequent plating process naturally inherits this roughness, eliminating the need for additional post-plating surface modification steps and simplifying the overall manufacturing process while achieving the desired viewing angle and radiation width.
Solution Approach 2:
The patent merges the surface roughness creation step with the reflective plating layer formation process. By forming the reflective plating layer directly on the pre-treated rough surface, the patent combines two functions (creating roughness and applying reflective coating) into a single integrated process, reducing manufacturing complexity while achieving both diffusion roughness and high reflectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases the viewing angle and radiation width of light-emitting device packages, providing uniform brightness with a reduced number of packages, thus lowering manufacturing costs and improving light extraction efficiency.
Implementation Method 1
The etching process may include applying at least one of a stripper, a hydrogen peroxide-sulfuric acid-based soft etching solution, and an oxidizing agent onto the base substrate
Implementation Method 2
The forming the diffusion roughness may be performed by applying at least one of an etching process, an oxidation process, mechanical stamping, and surface polishing onto the base substrate
Implementation Method 3
a plating process may be performed by applying a high current-applying plating onto the base substrate by using a plating solution, containing at least one of nickel (Ni) and copper (Cu) having low concentration, as a plating material
Data Source
AI summary
A method of manufacturing a lead frame for a light-emitting device package and a light-emitting device package are provided. The method of manufacturing a lead frame for a light-emitting device package includes: preparing a base substrate for the lead frame; forming diffusion roughness on the base substrate; and forming a reflective plating layer on the diffusion roughness formed base substrate.