Light Emitting Device Lead Frame Segmentation for Stiffness

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Solution Overview

Problem

Conventional light emitting devices face challenges in enhancing stiffness and heat radiation efficiency, particularly in the central portion of the device, which affects reliability and performance.

Innovation Solution

A light emitting device design featuring a body with a cavity and lead frames that protrude in a widthwise direction, allowing for improved structural integrity and heat dissipation by arranging lead frames and light emitting chips in a specific configuration to enhance stiffness and heat radiation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If lead frames are arranged in a conventional configuration, then the device structure is simple, but the stiffness of the central portion is insufficient

Engineering Contradiction:
Improvestiffness of central portionVSAvoidlead frame configuration
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The lead frame is divided into multiple segments (first lead frame, second lead frame, third lead frame, fourth lead frame) arranged in a specific pattern. This segmentation allows each segment to contribute to the overall structural stiffness, particularly enhancing the central portion's rigidity while maintaining manufacturing feasibility through modular assembly

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The lead frames are positioned asymmetrically within the body, with specific lead frames (first and second) extending further than others (third and fourth). This asymmetric arrangement creates a balanced structural support system that enhances central stiffness while optimizing the distribution of mechanical stresses throughout the device

Inventive Principle:
Principle #4Asymmetry

2Strength

If lead frames are arranged to enhance stiffness, then structural integrity improves, but heat radiation efficiency may be compromised

Engineering Contradiction:
Improvestructural integrityVSAvoidheat radiation efficiency
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

Different regions of the lead frame structure are optimized for different functions: the central portion's lead frames are configured to maximize stiffness and structural support, while the outer lead frames (first and second) are positioned to extend closer to the body's edges, creating optimal pathways for heat dissipation from the light emitting chips to the heat sink

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The lead frames are arranged in multiple dimensions within the body cavity, with varying extension lengths and positions. This multi-dimensional arrangement allows the structure to simultaneously achieve mechanical stiffness in the central region while providing thermal conduction pathways that extend toward the heat sink, effectively separating structural and thermal functions in different spatial dimensions

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Temperature

If multiple lead frames are disposed in the cavity, then heat dissipation pathways increase, but device complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoidnumber of lead frames
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

Each lead frame is designed to serve multiple functions: electrical connection, mechanical support, and heat conduction. The lead frames act as both structural elements that enhance device stiffness and thermal pathways that conduct heat from the light emitting chips to the heat sink, eliminating the need for separate components and reducing overall device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances the stiffness and reliability of the light emitting device, while also improving heat radiation efficiency, leading to improved performance and reliability of the device.

Implementation Method 1

A light emitting device may have, for example, a light emitting diode. The light emitting diode, which is a kind of a semiconductor device for converting electrical energy into light

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 2

a plurality of lead frames electrically connected with a plurality of light emitting chips protrude in a direction toward a side having a longer length among sides of a body

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10340433B2Light emitting device
Publication Date: 2019.07.02 SUZHOU LEKIN SEMICON CO LTD
  • US10340433B2 patent drawing
  • US10340433B2 patent drawing
  • US10340433B2 patent drawing

AI summary

A light-emitting element disclosed in an embodiment comprises: a body having a cavity; first and second lead frames arranged in the cavity; a third lead frame arranged between the first and second lead frames in the cavity; a fourth lead frame arranged between the first and second lead frames and distanced from the third frame in the cavity; a first light-emitting chip arranged on the first lead frame; and a second light-emitting chip arranged on the second lead frame, wherein the body comprises: first and second sides arranged on opposing sides from each other; and third and fourth sides arranged on opposing sides from each other, the first lead frame comprises first and second lead parts protruding toward the first and second sides, the second lead frame comprises third and forth lead parts protruding toward the first and second sides, the third frame comprises a fifth lead part protruding toward the first side, and the fourth lead frame comprises a sixth lead part protruding toward the second side.