LED Lead Wall Structure for Light Extraction and Resin Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting devices face challenges in achieving high light extraction efficiency and reliability, particularly due to separation issues between leads and the resin part, which affect performance and longevity.
Innovation Solution
A light emitting device design featuring a first substrate with leads held by a resin part, a second substrate with a light emitting element, and a wall part that straddles and covers the leads, reducing separation and enhancing heat dissipation while optimizing the height and width of the wall part to improve light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a resin part is used to hold leads in place, then ease of manufacture is improved, but separation between leads and resin part occurs reducing reliability
Solution Approach 1:
The resin part is divided into two functional segments: a base portion that provides structural support and a protruding portion that specifically engages with the leads. This segmentation allows the resin part to simultaneously provide easy manufacturing through injection molding while preventing lead separation through the mechanically interlocking protruding portion.
Solution Approach 2:
The protruding portion of the resin part acts as an intermediary element between the leads and the base. It provides a mechanical interface that secures the leads in place while maintaining electrical isolation, thus improving reliability without complicating the manufacturing process.
2Illumination intensity
If light extraction efficiency is improved by optimizing structure, then light output is enhanced, but device complexity increases
Solution Approach 1:
The resin part is designed to perform multiple functions simultaneously: it provides mechanical support for the leads, electrical insulation, and optical functions for light extraction enhancement. The protruding portion that secures the leads also serves as a light scattering structure, eliminating the need for separate components and reducing overall device complexity.
Solution Approach 2:
The structural support function and light extraction function are merged into a single resin part component. The same protruding portion that mechanically secures the leads also scatters light to improve extraction efficiency, thereby enhancing light output without increasing device complexity.
3Illumination intensity
If the wall part height is increased to improve light extraction, then light output is enhanced, but the wall part may block light from the light emitting element
Solution Approach 1:
The resin part exhibits local quality variations: the base portion has a height optimized for structural support, while the protruding portion has a reduced height specifically designed to avoid blocking light from the light emitting element. This localized height differentiation allows the structure to enhance light extraction through scattering while preventing light blocking.
Solution Approach 2:
The height parameter of the resin part is optimized differently for different functional regions. The protruding portion has a height parameter specifically tuned to be lower than the light emitting element, changing the geometric parameter to simultaneously achieve light scattering for extraction enhancement and avoid light blocking.
Data Source
AI summary
A light emitting device includes: a first substrate including: a first lead, and a second lead positioned apart from the first lead; a second substrate disposed on an upper face of the second lead, the second substrate including: a base, and a first conducting part disposed on an upper face of the base; a light emitting element disposed on the second substrate and electrically connected to the first conducting part; a first wire electrically connecting the first lead and the first conducting part; and a wall part straddling and covering an upper face of the first lead and an upper face of the second lead. A height of the wall part is less than a height of the second substrate.