LED Lead Frame Structure for Visible Bonding Layer Inspection
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Solution Overview
Problem
In the manufacturing of lead frame structures for light-emitting diodes (LEDs), the bonding layer between the lead frame and the circuit board is difficult to observe, leading to defects and reduced yield due to non-uniform application.
Innovation Solution
The lead frame structure includes extending conductive portions that protrude beyond a blocking wall, allowing the bonding layer to overflow and be easily visible, ensuring uniform application and improved inspection during the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the lead frame structure is manufactured with a flat lateral surface (conventional design), then the manufacturing process is simple, but the bonding layer cannot be observed during inspection
Solution Approach 1:
The patent introduces a third dimension by making the conductive portions protrude horizontally beyond the blocking wall surface. This dimensional change allows the bonding layer to be visible from the side, solving the inspection problem while maintaining manufacturing simplicity.
Solution Approach 2:
The protruding conductive portions act as intermediaries that allow the bonding layer to be indirectly observed. By making the bonding layer visible through these protrusions, inspectors can verify bonding quality without complex inspection equipment or procedures.
2Manufacturing precision
If the bonding layer is applied uniformly (ideal condition), then the lead frame structure quality is high, but non-uniform application causes defects and reduces yield
Solution Approach 1:
The protruding conductive portions provide visual feedback about bonding layer application quality. Inspectors can immediately see whether the bonding layer is uniform and proper, allowing for real-time quality control and reducing defects that would otherwise reduce yield.
3Strength
If the blocking wall completely covers the conductive portions (conventional design), then the structural integrity is maintained, but the bonding layer application cannot be verified
Solution Approach 1:
The patent applies local quality by making only the conductive portions protrude beyond the blocking wall while keeping the rest of the structure covered. This localized protrusion provides inspection access without compromising the overall structural integrity and blocking function.
Data Source
AI summary
The present disclosure is related to a lead frame structure. The lead frame structure includes a bottom board and a blocking wall. The bottom board has a first conductive portion and a second conductive portion. The first conductive portion separates from the second conductive portion. The first and second conductive portions are configured to electrically connect to a light source. The blocking wall is located on the bottom board, and the blocking wall surrounds an opening. The first and the second conductive portions are exposed from the opening. The first and the second conductive portions each have an extending portion. The extending portion extends beyond an external surface of the blocking wall in a horizontal direction.