Wafer-Level LED Lens Board with Embedded Phosphor
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Solution Overview
Problem
Traditional methods of manufacturing semiconductor light-emitting devices, such as LEDs, are inefficient and costly due to the one-by-one process, which results in long manufacturing times and thermal wear of phosphor, reducing its efficiency.
Innovation Solution
A process involving a substrate with multiple light-emitting devices and a lens board with embedded phosphor microlenses, where optical glue is applied to align and adhere the lens board to the substrate, encapsulating each LED with a microlens to prevent air gaps and thermal wear, while allowing for wafer-level manufacturing and precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional one-by-one manufacturing methods are used, then each LED can be individually processed, but manufacturing time becomes very long and productivity is low
Solution Approach 1:
Multiple individual LED processing steps (wire bonding, phosphor application, lens molding) are merged into a single automated assembly operation where a pre-assembled LED array with integrated phosphor and lenses is installed as one unit, dramatically reducing manufacturing time and increasing productivity
Solution Approach 2:
The phosphor and lenses are pre-applied to the LED array before final assembly, allowing the LEDs to be prepared in advance and reducing the number of steps required during the actual manufacturing process
2Use of energy by moving object
If phosphor is applied close to or in contact with LED, then phosphor conversion efficiency can be maximized, but thermal wear occurs over time that lowers phosphor thermal efficiency
Solution Approach 1:
An adhesive layer is introduced as an intermediary between the phosphor and LED, maintaining close proximity for efficient energy transfer while providing thermal protection that reduces thermal wear on the phosphor over time
Solution Approach 2:
The system uses a composite structure combining LED, adhesive layer, and phosphor, where the adhesive material serves dual functions of optical coupling and thermal protection, balancing conversion efficiency with thermal reliability
3Ease of manufacture
If hand-mixing of phosphor glue is used, then phosphor can be applied to LEDs, but the manufacturing process becomes relatively costly
Solution Approach 1:
The phosphor mixing and application processes are merged into a single automated operation using pre-prepared phosphor adhesive, eliminating the need for manual mixing and reducing process complexity
Solution Approach 2:
The system uses pre-prepared phosphor adhesive that is ready for application, eliminating the need for on-site mixing and preparation steps, thereby simplifying the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces manufacturing time, increases phosphor conversion efficiency, and enhances the reliability of LED devices by maintaining phosphor thermal efficiency and providing a more efficient and automated process compared to traditional methods.
Implementation Method 1
placing an optical glue on each of the microlenses... adhering the lens board to the module so that the optical glue prevents air gaps between the each of the light-emitting devices and the respective micro lenses
Implementation Method 2
phosphor is included as a part of the lens board... increases phosphor conversion efficiency
Data Source
AI summary
A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.