Lid Body Segmentation for LED Hermeticity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light-emitting devices with a single opening for multiple light-emitting elements face reduced bonding strength and hermeticity due to thermal stress, as the size of the transmissive member increases with more elements, leading to potential separation of weaker bonded portions.
Innovation Solution
A light-emitting device design featuring a lid body with a non-transmissive member including an outer frame and inner frames, where a transmissive member integrally covers multiple openings defined by these frames, and an adhesive member is applied only on the outer frame, not on the inner frames, enhancing bonding strength and maintaining hermeticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If only one opening is provided for multiple light-emitting elements, then the device structure is simplified, but the bonding strength and hermeticity are reduced due to increased transmissive member size and thermal stress
Solution Approach 1:
The single opening is divided into multiple openings by adding inner frames to the lid body. This segmentation allows the transmissive member to be smaller in each region, improving bonding strength and hermeticity while maintaining the simplified overall structure. The inner frames create multiple bonding regions with the adhesive member, distributing the thermal stress and preventing separation.
2Strength
If adhesive member is formed on the periphery of each opening to improve bonding strength, then bonding strength is improved, but the distance between openings must be sufficient to accommodate bonding members
Solution Approach 1:
The adhesive member is applied continuously from the outer frame through the inner frames, merging the bonding function across multiple openings. This continuous bonding approach improves bonding strength without requiring large distances between openings, as the adhesive member forms an integrated bonding structure that distributes stress across the entire lid body surface.
3Productivity
If the disposition density of light-emitting elements is increased, then the productivity and light output are improved, but the transmissive member size increases leading to reduced bonding strength
Solution Approach 1:
By dividing the lid body into multiple regions with inner frames, the patent enables high disposition density of light-emitting elements while keeping each transmissive member portion small. The segmentation creates multiple bonding regions that maintain bonding strength even as the overall number of elements increases, allowing high productivity without sacrificing bonding reliability.
Data Source
AI summary
A light-emitting device includes: a package body; a lid body connected to the package body, wherein the package body and the lid body together form a sealed space; and a plurality of light-emitting elements disposed in the sealed space. The lid body includes: a non-transmissive member including an outer frame, and one or more inner frames connected to the outer frame, wherein the outer frame and the one or more inner frames define a plurality of openings, a transmissive member integrally covering the plurality of openings and configured to allow light emitted from the plurality of light-emitting elements to be transmitted through the plurality of openings, and an adhesive member fixing the transmissive member to the non-transmissive member. The adhesive member is located on the outer frame and is not located on the one or more inner frames.