LED Light Assembly with Thermal Vanes and Light Pipes
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Solution Overview
Problem
Existing lighting solutions, such as compact fluorescent bulbs and light-emitting diode (LED) lights, face issues with heat management, leading to premature failure and environmental concerns, while lacking the same light spectrum as incandescent bulbs.
Innovation Solution
A light assembly design featuring a light source circuit board with light pipes and thermal vanes that form a heat sink to manage heat, along with a driver circuit board, which includes a conductive layer and insulating layers to enhance thermal conductivity and extend the lifespan of light sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If light-emitting diode lights are used to reduce power consumption and environmental impact, then energy efficiency and environmental friendliness are improved, but heat management becomes problematic leading to premature failure
Solution Approach 1:
The heat sink is segmented into multiple thermal vanes that are distributed around the light sources. Each vane independently conducts heat away from the LED packages, improving overall heat management efficiency and preventing localized overheating that would reduce lifespan.
Solution Approach 2:
The light pipe assembly serves multiple functions: it guides light from the LED to the desired location, provides a structural mounting framework, and works in conjunction with the thermal vanes to manage heat dissipation. This multi-functionality reduces the need for separate components, improving reliability.
2Temperature
If thermal vanes are added to remove heat from light sources, then heat management is improved, but device complexity increases
Solution Approach 1:
The thermal vanes are integrated with the light pipe assembly and circuit board structure. The vanes extend from the circuit board through the light pipe housing, combining the heat sink function with the existing structural components rather than adding entirely separate heat management hardware.
Solution Approach 2:
The thermal vanes extend in the axial direction along the light pipes, utilizing the vertical space already available in the housing. This dimensional approach allows effective heat dissipation without increasing the horizontal footprint or requiring additional lateral space.
3Illumination intensity
If light pipes are positioned adjacent to light sources, then light output is optimized, but heat dissipation path becomes more complex
Solution Approach 1:
The light pipes are positioned to receive light directly from the LED packages mounted on the circuit board. The same structural framework that positions the light pipes for optimal light extraction also provides the mounting structure for the thermal vanes, combining optical and thermal management functions.
4Volume of moving object
If driver circuit board is placed within the cavity formed by light pipes, then space utilization is improved, but heat management for electronics becomes more challenging
Solution Approach 1:
The driver circuit board is positioned in the axial direction within the cavity, utilizing the vertical space between the light pipes. This arrangement allows the electronics to be housed in the available volume without requiring additional lateral space, while the open cavity structure maintains adequate thermal access.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat, extending the lifespan of light sources and providing a more environmentally friendly alternative with customizable light output and spectrum.
Implementation Method 1
A plurality of thermal vanes form a heat sink for removing heat from the light sources
Implementation Method 2
A plurality of light pipes axially extend from and adjacent to each light source
Data Source
AI summary
A light assembly includes a light source circuit board and a plurality of light-emitting diodes disposed on the light source circuit board. A plurality of light pipes axially extends from and adjacent to each light-emitting diode. Each light pipe has a respective first end adjacent to the plurality of light-emitting diodes and a second end opposite to the light-emitting diodes. The plurality of light pipes communicates light from the light-emitting diodes therethrough and defines a cavity therebetween. A plurality of thermal vanes forms a heat sink for removing heat from the light-emitting diodes. The plurality of thermal vanes extend adjacent to the plurality of light pipes. A driver circuit board is disposed within the cavity.